Transceiver configuration for millimeter wave wireless communications

ABSTRACT

Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.

CROSS REFERENCES

The present application for patent claims priority to U.S. ProvisionalPatent Application No. 62/119,764 by Weissman et al., entitled“Transceiver Configuration for Millimeter Wave Wireless Communications,”filed Feb. 23, 2015, U.S. Provisional Patent Application No. 62/119,766by Weissman et al., entitled “Transceiver Architecture for MillimeterWave Wireless Communications,” filed Feb. 23, 2015, and U.S. ProvisionalPatent Application No. 62/120,815 by Weissman et al., entitled “MultipleArray MMW Transceiver Operation,” filed Feb. 25, 2015 assigned to theassignee hereof, and expressly incorporated by reference herein.

BACKGROUND

1. Field of the Disclosure

The present disclosure relates to wireless communication systems, andmore particularly to a transceiver configuration for millimeter wavewireless communications.

2. Description of Related Art

Wireless communication systems are widely deployed to provide varioustypes of communication content such as voice, video, packet data,messaging, broadcast, and so on. These systems may be multiple-accesssystems capable of supporting communication with multiple users bysharing the available system resources (e.g., time, frequency, andpower). Examples of such multiple-access systems include code-divisionmultiple access (CDMA) systems, time-division multiple access (TDMA)systems, frequency-division multiple access (FDMA) systems, andorthogonal frequency-division multiple access (OFDMA) systems.

By way of example, a wireless multiple-access communication system mayinclude a number of base stations, each simultaneously supportingcommunication for multiple communication devices, otherwise known asuser equipments (UEs). A base station may communicate with UEs ondownlink channels (e.g., for transmissions from a base station to a UE)and uplink channels (e.g., for transmissions from a UE to a basestation). The UEs may support communications using different frequencyranges for the same or different wireless communications systems.

The UEs may support communications on different frequencies using twotransceivers. Some transceivers may use a zero-intermediate frequency(ZIF) transceiver architecture or a sliding-intermediate frequency (SIF)transceiver architecture. In a ZIF transceiver architecture, thetransceiver converts the radio frequency (RF) signals directly to andfrom baseband signals, e.g., analog baseband data signals, to eliminatecircuitry associated with employing an intermediate frequency (IF). Incontrast, a SIF transceiver architecture converts RF signals to an IFsignal, and in some cases two IF signals, before converting the IFsignal to the baseband signal, and vice versa. For communicating in themillimeter wave (mmW) frequency ranges, e.g., 28 GHz, 40 GHz, 60 GHz,etc., current configurations include separate circuitry for eachtransceiver configuration. For instance, a ZIF mmW transceiverarchitecture may include a baseband circuitry (e.g., oscillator(s),modem(s), etc.) soldered onto the module/circuit board having the RFfront end (RFFE) and associated antenna array for the ZIF mmWtransceiver. A SIF mmW transceiver, however, may have one module/circuitboard for the baseband circuitry and another one for the RFFE andassociated antenna array. Current configurations, therefore, utilizeseparate circuitry, modules, and circuit boards for each transceiverconfiguration which results in added hardware components, excessivehardware footprints, and associated power requirements.

The UEs may support communications on different frequencies using twotransceivers. Some transceivers may use a sliding-intermediate frequency(SIF) transceiver architecture or a super heterodyne transceiverarchitecture. In SIF transceiver architecture, a local oscillator (LO)is used to convert the baseband signal to an intermediate frequency (IF)first, and then to the radio frequency (RF) frequency for wirelesstransmission. In a super heterodyne transceiver architecture, two LOsmay be used, one for the IF conversion and another for the RFconversion. For communicating in the millimeter wave (mmW) frequencyranges, e.g., 28 GHz, 40 GHz, 60 GHz, etc., current configurationsinclude separate circuitry for each transceiver configuration. Forinstance, and for dual transceiver functionality, two modules/printedcircuit boards (PCBs) may be used to implement each mmW transceiver. Forexample, each transceiver may include a baseband board (e.g.,oscillator(s), modem(s), etc.) soldered onto one module/PCB and a RFfront end (RFFE) and associated antenna array soldered onto a differentmodule/PCB. For the dual transceiver functionality, that results in fourmodules/PCBs being used. Current configurations, therefore, utilizeseparate circuitry, modules, and circuit boards for each transceiverconfiguration which results in added hardware components, an excessivehardware footprint, and associated power requirements.

In some cases, a wireless communications system may utilize beamformingto increase the throughput between a base station and a UE. Thethroughput may depend on the antenna arrangement and the distancebetween the transmitter and receiver. A system design that does not takeinto account the increased throughput available at short distances mayhave a reduced throughput limit. Furthermore, a system with singleantenna array with a limited number of elements at a base station mayinvolve an increased number of antenna elements at a UE to achieve adesired throughput.

SUMMARY

The described features generally relate to one or more improved systems,methods, and/or devices for transceiver architecture in a millimeterwave wireless communication system. Generally, the described transceiverarchitecture may provide two transceivers positioned on separate chipmodules and connected using a single coaxial cable. The two transceiversmay share a baseband sub-module to reduce the hardware footprint. Insome examples, a first transceiver chip module may include the basebandsub-module and the first RFFE circuitry and associated antenna array. Asecond transceiver chip module may include a second RFFE circuitry andassociated antenna array. The second transceiver chip module may belocated separate from the first transceiver chip module, but connectedto the baseband sub-module via a coaxial cable. The first transceiverchip module may have a ZIF transceiver architecture and the second chipmodule may have a SIF transceiver architecture.

Accordingly, the coaxial cable may carry an IF signal, in addition toother signaling and/or control information, between the basebandsub-module of the first transceiver chip module and the RFFE circuitryof the second transceiver chip module. Accordingly, the dual-transceivermodule configuration of the present description may provide for twotransceivers, each of which may communicate on different frequencyranges, but which are positioned on different parts of a wirelessdevice.

In an illustrative set of examples, an apparatus for wirelesscommunication is provided. The apparatus may include: a firsttransceiver chip module comprising a baseband sub-module associated witha baseband signal, a first radio frequency front end (RFFE) componentand associated first antenna array, the first RFFE component andassociated first antenna array configured to communicate in a firstfrequency range; and a second transceiver chip module comprising asecond RFFE component and associated second antenna array, the secondtransceiver chip module separate from and electrically coupled with thebaseband sub-module of the first transceiver chip module, the secondRFFE component and associated second antenna array configured tocommunicate in a second frequency range different from the firstfrequency range.

In some examples, the apparatus may include a single coaxial cableelectrically coupling the second transceiver chip module with thebaseband sub-module. The second transceiver chip module may beconfigured to receive at least one of the baseband signal, or a localoscillator signal, a control signal, or combinations thereof, from thebaseband sub-module of the first transceiver chip module. The secondtransceiver chip module may include: a frequency converter configured toup-convert the baseband signal received from the baseband sub-module andoutput a signal within the second frequency range for wirelesstransmission, the frequency converter being further configured todown-convert a signal received from the second RFFE component forwireless reception and output a signal having a frequency of thebaseband signal.

In some examples, the baseband sub-module may include a first modemconfigured to communicate in the first frequency range, and a secondmodem configured to communicate in the second frequency range. Theapparatus may include a switching component configured to switch aninformation signal between the first modem for communications in thefirst frequency range and the second modem for communications in thesecond frequency range. The baseband sub-module may include a dual-bandmodem configured to communicate in the first frequency range and in thesecond frequency range.

In some examples, signals of the first frequency range are time-divisionmultiplexed with signals of the second frequency range. The first RFFEcomponent may be a zero-intermediate frequency (IF) RFFE and the secondRFFE component may be a sliding IF RFFE. The baseband signal may bewithin the first frequency range, the baseband signal being used as anintermediate frequency (IF) for the second transceiver chip module andconverted to the second frequency range. The first frequency range maybe lower than the second frequency range.

In some examples, the first frequency range may be associated with awireless telecommunication system and the second frequency range may beassociated with a Wi-Fi communication system. The first frequency rangemay be associated with a communications protocol operating at or aboutthe 28 GHz frequency range and the second frequency range may beassociated with a communications protocol operating at or about the 60GHz frequency range. The first frequency range may be associated with acommunications protocol operating at or about the 40 GHz frequency rangeand the second frequency range may be associated with a communicationsprotocol operating at or about the 60 GHz frequency range. The firstfrequency range and the second frequency range may be millimeter wavefrequency ranges.

In another illustrative set of examples, an apparatus for wirelesscommunications is provided. The apparatus may include: means forcommunicating via a first transceiver chip module that comprises abaseband sub-module associated with a baseband signal, a first radiofrequency front end (RFFE) component and associated first antenna array,the first RFFE component and associated first antenna array configuredto communicate in a first frequency range; and means for communicatingvia a second transceiver chip module that comprises a second RFFEcomponent and associated second antenna array, the second transceiverchip module separate from and electrically coupled with the basebandsub-module of the first transceiver chip module, the second RFFEcomponent and associated second antenna array configured to communicatein a second frequency range different from the first frequency range.

In some examples, the apparatus may include means for electricallycoupling, using a single coaxial cable, the second transceiver chipmodule with the baseband sub-module. The second transceiver chip modulemay be configured to receive at least one of the baseband signal, alocal oscillator signal, a control signal, or combinations thereof, fromthe baseband sub-module of the first transceiver chip module. The secondtransceiver chip module may include means for providing a frequencyconverter configured to up-convert the baseband signal received from thebaseband sub-module and output a signal within the second frequencyrange for wireless transmission, wherein the frequency converter beingfurther configured to down-convert a signal received from the secondRFFE component for wireless reception and output a signal having afrequency of the baseband signal.

In some examples, the baseband sub-module may include means forproviding a first modem configured to communicate in the first frequencyrange, and means for providing a second modem configured to communicatein the second frequency range. The apparatus may include means forproviding a switching component configured to switch an informationsignal between the first modem for communications in the first frequencyrange and the second modem for communications in the second frequencyrange. The baseband sub-module may include means for providing adual-band modem configured to communicate in the first frequency rangeand in the second frequency range. Signals of the first frequency rangemay be time-division multiplexed with signals of the second frequencyrange.

In some examples, the first RFFE component is a zero-intermediatefrequency (IF) RFFE and the second RFFE component is a sliding IF RFFE.The baseband signal may be within the first frequency range, thebaseband signal being used as an intermediate frequency (IF) for thesecond transceiver chip module and converted to the second frequencyrange. The first frequency range may be lower than the second frequencyrange. The first frequency range may be associated with a wirelesstelecommunication system and the second frequency range may beassociated with a Wi-Fi communication system.

In some examples, the first frequency range may be associated with acommunications protocol operating at or about the 28 GHz frequency rangeand the second frequency range may be associated with a communicationsprotocol operating at or about the 60 GHz frequency range. The firstfrequency range may be associated with a communications protocoloperating at or about the 40 GHz frequency range and the secondfrequency range may be associated with a communications protocoloperating at or about the 60 GHz frequency range. The first frequencyrange and the second frequency range may be millimeter wave frequencyranges.

In another illustrative set of examples, a method for wirelesscommunication is provided. The method may include: communicating in afirst frequency range via a first transceiver chip module, the firsttransceiver chip module comprising a baseband sub-module associated witha baseband signal and a first radio frequency front end (RFFE) componentand associated first antenna array, the first RFFE component andassociated first antenna array configured to communicate in the firstfrequency range; and communicating in a second frequency range via asecond transceiver chip module, the second transceiver chip modulecomprising a second RFFE component and associated second antenna array,the second transceiver chip module separate from and electricallycoupled with the baseband sub-module of the first transceiver chipmodule, the second RFFE component and associated second antenna arrayconfigured to communicate in the second frequency range different fromthe first frequency range.

In some examples, the method may include coupling, the basebandsub-module of the first transceiver chip module with the secondtransceiver chip module using a single coaxial cable.

A method of wireless communication is described. The method may includeperforming a beam sweep operation on beams created by two or more arraysof a plurality of antenna arrays, and selecting an array from theplurality of antenna arrays for communication with a target wirelessdevice based at least in part on the beam sweep operation.

An apparatus for wireless communication is described. The apparatus mayinclude means for performing a beam sweep operation on beams created bytwo or more arrays of a plurality of antenna arrays, and means forselecting an array from the plurality of antenna arrays forcommunication with a target wireless device based at least in part onthe beam sweep operation.

A further apparatus for wireless communication is described. Theapparatus may include a processor, memory in electronic communicationwith the processor, and instructions stored in the memory and operable,when executed by the processor, to cause the apparatus to perform a beamsweep operation on beams created by two or more arrays of a plurality ofantenna arrays, and select an array from the plurality of antenna arraysfor communication with a target wireless device based at least in parton the beam sweep operation.

A non-transitory computer-readable medium storing code for wirelesscommunication is described. The code may include instructions executableto perform a beam sweep operation on beams created by two or more arraysof a plurality of antenna arrays, and select an array from the pluralityof antenna arrays for communication with a target wireless device basedat least in part on the beam sweep operation.

Some examples of the method, apparatuses, or non-transitorycomputer-readable medium described herein may further include processes,features, means, or instructions for determining that a targetthroughput is greater than a threshold, determining that a transceiverfor the target wireless device is available, the transceiver operatingin a first mmW frequency range, and transmitting a handoff signal to thetarget wireless device based at least in part on the determination thatthe target throughput is greater than the threshold, the determinationthat the transceiver is available, and the beam sweep operation, whereinthe handoff signal directs the target wireless device to use thetransceiver for communication. Additionally or alternatively, someexamples may include processes, features, means, or instructions fortransmitting an activation signal to the target wireless devicedirecting the target wireless device to activate the transceiver, andcommunicating with the target wireless device using the selected arrayand the transceiver.

In some examples of the method, apparatuses, or non-transitorycomputer-readable medium described herein, the activation signal istransmitted using a second mmW frequency range, the second mmW frequencyrange being different from first mmW frequency range. Additionally oralternatively, in some examples the threshold is 1 Gbps.

In some examples of the method, apparatuses, or non-transitorycomputer-readable medium described herein, the first mmW frequency rangeis a 60 GHz range. Additionally or alternatively, some examples mayinclude processes, features, means, or instructions for selecting aninitial array from the plurality of antenna arrays for the beam sweepoperation, wherein performing the beam sweep operation comprisessweeping through each of a first plurality of beams associated with theinitial array.

Some examples of the method, apparatuses, or non-transitorycomputer-readable medium described herein may further include processes,features, means, or instructions for selecting a subsequent array fromthe plurality of antenna arrays for the beam sweep operation, whereinperforming the beam sweep operation comprises sweeping through each of asecond plurality of beams associated with the subsequent array.Additionally or alternatively, some examples may include processes,features, means, or instructions for determining that a channelparameter associated with the array satisfies a threshold conditionbased at least in part on the beam sweep operation, wherein selectingthe array is based at least in part on the determination.

In some examples of the method, apparatuses, or non-transitorycomputer-readable medium described herein, a first array of theplurality of antenna arrays is located at an opposite side of the mmWbase station relative to a second array of the plurality of arrays basedat least in part on a spatial diversity configuration. Additionally oralternatively, in some examples at least one array of the plurality ofantenna arrays is configured for operation in a mmW frequency range.

In some examples of the method, apparatuses, or non-transitorycomputer-readable medium described herein, the at least one array isconfigured for operation in a first mmW frequency range that operates ator about 28 GHz or in a second mmW frequency range that operates at orabout 40 GHz. Additionally or alternatively, in some examples the atleast one array is paired with at least one adjacent array configuredfor operation in a third mmW frequency range that operates at or about60 GHz.

In some examples of the method, apparatuses, or non-transitorycomputer-readable medium described herein, each of the plurality ofantenna arrays is configured with an increased number of antennaelements.

In another illustrative set of examples, an apparatus for wirelesscommunication is provided. The apparatus may include: a baseband chipmodule comprising first baseband circuitry for baseband processing ofwireless communications in a first frequency range and second basebandcircuitry for baseband processing of wireless communications in a secondfrequency range; and a dual-transceiver chip module separate from and inelectrical communication with the baseband chip module, thedual-transceiver chip module comprising a dual-band radio frequencyfront end (RFFE) component, a first antenna array adapted for wirelesscommunications in the first frequency range, and a second antenna arrayadapted for wireless communications in the second frequency range, thedual-band RFFE component coupled with the first antenna array and thesecond antenna array, wherein at least one of the first frequency rangeand the second frequency range may be millimeter wave frequency ranges.

In some examples, the apparatus may include a single coaxial wireelectrically coupling the dual-transceiver chip module with the basebandchip module. The first antenna array may be positioned on an opposingside of the dual-transceiver chip module with respect to the secondantenna array. The first antenna array may be positioned on a differentlayer of the dual-transceiver chip module with respect to the secondantenna array. The first baseband circuitry may include a first modemconfigured to communicate in the first frequency range and a secondmodem configured to communicate in the second frequency range.

In some examples, the baseband chip module may include a commoninterface circuitry configured to communicate information associatedwith the first modem and the second modem. The baseband chip module mayinclude a first communication interface circuitry configured tocommunicate information associated with the first modem, and a secondcommunication interface circuitry configured to communicate informationassociated with the second modem. The baseband chip module may include afirst multiplexer and the dual-transceiver chip module may include asecond multiplexer, the first multiplexer and the second multiplexerconfigured to multiplex and de-multiplex electrical signals exchangedbetween the baseband chip module and the dual-transceiver chip module.

In some examples, the dual-transceiver chip module being in electricalcommunication with the baseband chip may include communicating at leastone of an intermediate frequency (IF) signal, or an oscillator signal,or a control signal, or combinations thereof. The dual-transceiver chipmodule may be in electrical communication with the baseband chip modulevia a cable, the cable configured to support communications of highbandwidth signals, wherein the high bandwidth signals comprise a firstintermediate frequency (IF) signal associated with the first frequencyrange and a second IF signal associated with the second frequency range,the first IF signal being different than the second IF signal.

In some examples, the first frequency range may be lower than the secondfrequency range. The first frequency range may be associated with awireless telecommunication system and the second frequency range may beassociated with a Wi-Fi communication system. The first frequency rangeand the second frequency range may be millimeter wave frequency ranges.

In another illustrative set of examples, an apparatus for wirelesscommunication is provided. The apparatus may include: means forcommunicating, using a baseband chip module and a dual-transceiver chipmodule, in a first frequency range via a first baseband circuitry of thebaseband chip module, the dual-transceiver chip module comprising adual-band radio frequency front end (RFFE) coupled to a first antennaarray adapted to communicate wireless signals in the first frequencyrange; and means for communicating, using the baseband chip module andthe dual-transceiver chip module, in a second frequency range via asecond baseband circuitry of the baseband chip module, thedual-transceiver chip module comprising the dual-band RFFE coupled to asecond antenna array adapted to communicate wireless signals in thesecond frequency range, wherein at least one of the first frequencyrange and the second frequency range may be millimeter wave frequencyranges.

In some examples, the apparatus may include means for electricallycoupling the dual-transceiver chip module with the baseband chip moduleusing a single coaxial cable. The first antenna array may be positionedon an opposing side of the dual-transceiver chip module with respect tothe second antenna array. The first antenna array may be positioned on adifferent layer of the dual-transceiver chip module with respect to thesecond antenna array. The first baseband circuitry may include a firstmodem configured to communicate in the first frequency range and asecond modem configured to communicate in the second frequency range.

In some examples, the baseband chip module may include means forproviding a common interface circuitry configured to communicateinformation associated with the first modem and the second modem. Thebaseband chip module may include means for providing a firstcommunication interface circuitry configured to communicate informationassociated with the first modem, and means for providing a secondcommunication interface circuitry configured to communicate informationassociated with the second modem. The baseband chip module may include afirst multiplexer and the dual-transceiver chip module may include asecond multiplexer, the first multiplexer and the second multiplexerconfigured to multiplex and de-multiplex electrical signals exchangedbetween the baseband chip module and the dual-transceiver chip module.

In some examples, the dual-transceiver chip module being in electricalcommunication with the baseband chip may include communicating at leastone of an intermediate frequency (IF) signal, or an oscillator signal,or a control signal, or combinations thereof. The dual-transceiver chipmodule may be in electrical communication with the baseband chip modulevia a cable, the cable configured to support communications of highbandwidth signals, wherein the high bandwidth signals may include afirst intermediate frequency (IF) signal associated with the firstfrequency range and a second IF signal associated with the secondfrequency range, the first IF signal being different than the second IFsignal.

In some examples, the first frequency range may be lower than the secondfrequency range. The first frequency range may be associated with awireless telecommunication system and the second frequency range may beassociated with a Wi-Fi communication system. The first frequency rangeand the second frequency range may be millimeter wave frequency ranges.

In another illustrative set of examples, a method for wirelesscommunication is provided. The method may include: communicating, usinga baseband chip module and a dual-transceiver chip module, in a firstfrequency range via a first baseband circuitry of the baseband chipmodule, the dual-transceiver chip module comprising a dual-band radiofrequency front end (RFFE) component coupled to a first antenna arrayadapted to communicate wireless signals in the first frequency range;and communicating, using the baseband chip module and thedual-transceiver chip module, in a second frequency range via a secondbaseband circuitry of the baseband chip module, the dual-transceiverchip module comprising the dual-band RFFE component coupled to a secondantenna array adapted to communicate wireless signals in the secondfrequency range, wherein at least one of the first frequency range andthe second frequency range may be millimeter wave frequency ranges.

In some examples, the dual-transceiver chip module being in electricalcommunication with the baseband chip may include communicating at leastone of an intermediate frequency (IF) signal, or an oscillator signal,or a control signal, or combinations thereof. The dual-transceiver chipmodule may be in electrical communication with the baseband chip modulevia a cable, the cable configured to support communications of highbandwidth signals, wherein the high bandwidth signals may include afirst intermediate frequency (IF) signal associated with the firstfrequency range and a second IF signal associated with the secondfrequency range, the first IF signal being different than the second IFsignal.

In some examples, the first frequency range may be lower than the secondfrequency range. The first frequency range may be associated with awireless telecommunication system and the second frequency range may beassociated with a Wi-Fi communication system. The first frequency rangeand the second frequency range may be millimeter wave frequency ranges.

The foregoing has outlined rather broadly the features and technicaladvantages of examples according to the disclosure in order that thedetailed description that follows may be better understood. Additionalfeatures and advantages will be described hereinafter. The conceptionand specific examples disclosed may be readily utilized as a basis formodifying or designing other structures for carrying out the samepurposes of the present disclosure. Such equivalent constructions do notdepart from the scope of the appended claims. Characteristics of theconcepts disclosed herein, both their organization and method ofoperation, together with associated advantages will be better understoodfrom the following description when considered in connection with theaccompanying figures. Each of the figures is provided for the purpose ofillustration and description only, and not as a definition of the limitsof the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

A further understanding of the nature and advantages of the presentinvention may be realized by reference to the following drawings. In theappended figures, similar components or features may have the samereference label. Further, various components of the same type may bedistinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. If only the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

FIG. 1 shows a block diagram of a wireless communication system, inaccordance with various aspects of the present disclosure;

FIG. 2A shows a block diagram of a device configured for use in wirelesscommunication, in accordance with various aspects of the presentdisclosure;

FIG. 2B shows a block diagram of a device configured for use in wirelesscommunication, in accordance with various aspects of the presentdisclosure;

FIG. 3A shows a block diagram of a device configured for use in wirelesscommunication, in accordance with various aspects of the presentdisclosure;

FIG. 3B shows a block diagram of a device configured for use in wirelesscommunication, in accordance with various aspects of the presentdisclosure;

FIG. 4A shows a block diagram of example transceiver chip modules foruse in wireless communication, in accordance with various aspects of thepresent disclosure;

FIG. 4B shows a block diagram of an example baseband chip module and adual-transceiver chip module for use in wireless communication, inaccordance with various aspects of the present disclosure;

FIG. 5A shows another block diagram of example transceiver chip modulesfor use in wireless communication, in accordance with various aspects ofthe present disclosure;

FIG. 5B shows another block diagram of an example baseband chip moduleand a dual-transceiver chip module for use in wireless communication, inaccordance with various aspects of the present disclosure;

FIG. 6 shows a block diagram of a wireless communication system, inaccordance with various aspects of the present disclosure;

FIG. 7 shows a block diagram of a wireless communication system, inaccordance with various aspects of the present disclosure;

FIG. 8 shows a block diagram of a wireless device that supports multiplearray mmW transceiver operation in accordance with various aspects ofthe present disclosure;

FIG. 9 shows a block diagram of a wireless device that supports multiplearray mmW transceiver operation in accordance with various aspects ofthe present disclosure;

FIG. 10 shows a block diagram of a wireless device that supportsmultiple array mmW transceiver operation in accordance with variousaspects of the present disclosure;

FIG. 11 illustrates a block diagram of a system including a base stationthat supports multiple array mmW transceiver operation in accordancewith various aspects of the present disclosure;

FIG. 12 shows example configurations for two antenna arrays on thedual-transceiver chip module for use in wireless communication, inaccordance with various aspects of the present disclosure;

FIG. 13 illustrates an example of a wireless communications subsystemthat supports multiple array mmW transceiver operation in accordancewith various aspects of the present disclosure;

FIG. 14 illustrates an example of a beam configuration that supportsmultiple array mmW transceiver operation in accordance with variousaspects of the present disclosure;

FIG. 15 illustrates an example of a beam sweeping decision flow thatsupports multiple array mmW transceiver operation in accordance withvarious aspects of the present disclosure;

FIG. 16 illustrates an example of a transceiver selection process flowthat supports multiple array mmW transceiver operation in accordancewith various aspects of the present disclosure;

FIG. 17 is a flow chart illustrating an example of a method for wirelesscommunication, in accordance with various aspects of the presentdisclosure;

FIG. 18 is a flow chart illustrating an example of a method for wirelesscommunication, in accordance with various aspects of the presentdisclosure;

FIG. 19 is a flow chart illustrating an example of a method for wirelesscommunication, in accordance with various aspects of the presentdisclosure;

FIG. 20 is a flow chart illustrating an example of a method for wirelesscommunication, in accordance with various aspects of the presentdisclosure;

FIG. 21 illustrates a method for multiple array mmW transceiveroperation in accordance with various aspects of the present disclosure;

FIG. 22 illustrates a method for multiple array mmW transceiveroperation in accordance with various aspects of the present disclosure;

FIG. 23 illustrates a method for multiple array mmW transceiveroperation in accordance with various aspects of the present disclosure;and

FIG. 24 illustrates a method for multiple array mmW transceiveroperation in accordance with various aspects of the present disclosure.

DETAILED DESCRIPTION

Evolving wireless communication systems may communicate using one ormore of several mmW frequency ranges, e.g., 28 GHz, 40 GHz, 60 GHz, etc.Different mmW frequency ranges may be used for different communicationsystems protocols, e.g., Wi-Fi communication systems, telecommunicationsystems, etc. Communications using such mmW frequencies, however,introduce design difficulties from an operational perspective (e.g.,limited propagation distance) as well as from a hardware perspective.For example, processing signals in the mmW frequency range requirescareful consideration and selection of components, component/modulespacing limitations, etc., in order to reduce signal loss. Otherconsiderations include spacing and positioning of antenna arrays foreach frequency range in a device that has limited available space andthat avoids interference caused by the user, e.g., how a user maytypically hold the device.

Millimeter wave systems may be used for a variety of functions, such aswithin communication systems, for research, weapon systems, medicalpurposes, screening systems, etc. In some cases, mmW systems may includemobile base stations, such as operating at 28 GHz or 40 GHz. Amulti-array transceiver may be used for enhanced coverage of a mmWtransceiver (such as a base station of a wireless communicationssystem). This may enable reduced power consumption and enlarged linkcapacity by another device (such as user equipment (UE) in closeproximity to a base station). In some cases, a transceiver deviceconfigured for enhanced mmW operations may be backwards compatible withdevices based on different technologies.

Typically, devices adapted to communicate in the mmW frequency rangeusing two transceivers adopt an approach that includes each transceiverhaving independent baseband circuitry. For example, each transceiverwould include its own baseband circuitry, RFFE components, andassociated antenna array. This configuration may allow for independentplacement of the two transceivers on the device, but also requiresadditional hardware for each baseband circuitry. This also results inincreased power usage at the device and, additionally requires routingaudio/data signals to each transceiver.

Typically, devices adapted to communicate in the mmW frequency rangeusing two transceivers adopt an approach that includes each transceiverconfiguration having independent baseband circuitry modules andtransceiver RFFE component modules. For example, each transceiver wouldinclude one module for the baseband circuitry and a separate module forthe RFFE components, and associated antenna array. This configurationmay allow for independent placement of the two transceivers on thedevice, but also requires additional hardware footprint for eachtransceiver. This also results in increased power usage at the deviceand, additionally requires routing audio/data signals to eachtransceiver.

According to aspects of the present disclosure, a device may utilize twotransceiver chip modules. A first transceiver chip module includes abaseband sub-module in addition to the RFFE and associated antennaarray. The baseband sub-module may include modem(s) that provide forcommunicating using the first RFFE and associated antenna array or usinga second transceiver chip module, which includes a second RFFE andassociated antenna array. The second transceiver chip module may beseparate from the first transceiver chip module, but connected to thebaseband sub-module using a coaxial cable. The coaxial cable may be awide bandwidth cable and may carry an IF frequency between the basebandsub-module and the second transceiver chip module. In some aspects, thefirst transceiver chip and the second transceiver chip modules maycommunicate on a first frequency range and a second frequency range,respectively, where the first frequency range is different than thesecond frequency range. In some aspects, the first RFFE may be a ZIFtransceiver architecture where the second RFFE may be a SIF transceiverarchitecture. In some examples, aspects of the IF associated with theSIF transceiver architecture of the second transceiver chip module maybe used as the RF band for the ZIF transceiver architecture of the firsttransceiver chip module.

According to aspects of the present disclosure, a device may utilize twomodules to implement two transceivers that are configured to communicateon different frequency ranges. A first of the modules includes abaseband chip module. The baseband chip module includes basebandcircuitry for processing of wireless communications in the firstfrequency range and the second frequency range. The first and secondfrequency ranges may be the same or may be different. The second moduleincludes a dual-transceiver chip module. The dual-transceiver chipmodule may include a dual-band RFFE component. The dual-band RFFEcomponent may include RF circuitry for processing wirelesscommunications in the first frequency range and the second frequencyrange. Accordingly, the dual-transceiver chip module may include twoantenna arrays, one antenna array for each of the first and secondfrequency ranges. The dual-band RFFE component is coupled to each of thetwo antenna arrays. In some aspects, the dual-band RFFE component may beconfigured such that, for each frequency range, the transceiver mayutilize a SIF transceiver architecture or a super-heterodyne transceiverarchitecture.

Millimeter wave base stations may use antenna arrays to transmit andreceive beam-formed signals. In some cases, UE transceivers may useantenna arrays and beam-forming as well. When an array transceiver istransmitting, N power amplifiers may be used to ignite an N-arrayantenna. A base station may have an N antennae array while a UE may havean M antennae array, often with M being less than N. A capacity of 1Gbps at medium and small distances from the base station may bepossible, though the maximum planned capacity does not account for thesmall distance scenario where the link budget rises above the requiredlink budget for increased throughput.

A mmW transceiver, such as for a base station, may include a multi-arrayantenna, which may increase spatial diversity and enhance coverage. Eacharray may have an increased number of antenna elements for bettereffective isotropic radiated power (EIRP) and, possibly, an increasedlink budget. A dual standard transceiver may be used, such as with onetransceiver for one set of mmW standards, such as 28 GHz or 40 GHzbands, while another transceiver may be used for other standards, suchas for 60 GHz bands. A UE transceiver may also include a multi-arrayantenna, which may increase spatial diversity and enhance coverage. Insome cases, each array may have a reduced number of antennae fortransmit and receive power saving. The UE may also include anothertransceiver for 60 GHz transmissions, such as for high capacity or closeproximity communications.

A UE transceiver configured in this manner may be capable of powersaving. For example, using a higher number of antenna elements at a basestation may allow for a reduction in the number of antenna elements atthe UE. The link budget may be reduced by reducing the number ofantennae at the UE, while the link budget may be increased by increasingthe number of antennae at the base station. As a result, the UE mayconsume less power. By using a high number of arrays at a base station,a UE may have higher coverage for reception and may consume less power.Some systems may include a transceiver that operates at or about 60 GHzfor communications at a close proximity to a base station. The link willperform handoff to this system at close proximity and may allow forcapacity to be increased, such as beyond 1 Gbps.

With a single antenna array, the antenna covers as wide an area aspossible, which may result in a half sphere beam on the broad side ofthe antenna array. In order to cover the widest angle with a good signalto noise ratio (SNR), beam sweeping may be used by creating beams indifferent directions and sweeping through them. This may consume time(calculated as the product of the beam transmit time and the number ofbeams). In one example, multiple antenna arrays may be used, whichreduces the coverage area for each individual antenna array. In thiscase, beam sweep time may be decreased as each array covers a narrowerangle. In some cases this may also impact time used for beam steering.

The following description provides examples, and is not limiting of thescope, applicability, or examples set forth in the claims. Changes maybe made in the function and arrangement of elements discussed withoutdeparting from the scope of the disclosure. Various examples may omit,substitute, or add various procedures or components as appropriate. Forinstance, the methods described may be performed in an order differentfrom that described, and various steps may be added, omitted, orcombined. Also, features described with respect to some examples may becombined in other examples.

FIG. 1 illustrates an example of a wireless communications system 100 inaccordance with various aspects of the disclosure. The wirelesscommunications system 100 includes base stations 105, UEs 115, and acore network 130. The core network 130 may provide user authentication,access authorization, tracking, Internet Protocol (IP) connectivity, andother access, routing, or mobility functions. The base stations 105interface with the core network 130 through backhaul links 132 (e.g.,51, etc.) and may perform radio configuration and scheduling forcommunication with the UEs 115, or may operate under the control of abase station controller (not shown). In various examples, the basestations 105 may communicate, either directly or indirectly (e.g.,through core network 130), with each other over backhaul links 134(e.g., X2, etc.), which may be wired or wireless communication links.

The base stations 105 may wirelessly communicate with the UEs 115 viaone or more base station antennas. Each of the base station 105 sitesmay provide communication coverage for a respective geographic coveragearea 110. In some examples, base stations 105 may be referred to as abase transceiver station, a radio base station, an access point, a radiotransceiver, a NodeB, eNodeB (eNB), Home NodeB, a Home eNodeB, or someother suitable terminology. The geographic coverage area 110 for a basestation 105 may be divided into sectors making up only a portion of thecoverage area (not shown). The wireless communications system 100 mayinclude base stations 105 of different types (e.g., macro and/or smallcell base stations). There may be overlapping geographic coverage areas110 for different technologies.

In some examples, the wireless communications system 100 is an LTE/LTE-Anetwork. In LTE/LTE-A networks, the term evolved Node B (eNB) may begenerally used to describe the base stations 105, while the term UE maybe generally used to describe the UEs 115. The wireless communicationssystem 100 may be a Heterogeneous LTE/LTE-A network in which differenttypes of eNBs provide coverage for various geographical regions. Forexample, each eNB or base station 105 may provide communication coveragefor a macro cell, a small cell, and/or other types of cell. The term“cell” is a 3GPP term that can be used to describe a base station, acarrier or component carrier associated with a base station, or acoverage area (e.g., sector, etc.) of a carrier or base station,depending on context.

A macro cell generally covers a relatively large geographic area (e.g.,several kilometers in radius) and may allow unrestricted access by UEswith service subscriptions with the network provider. A small cell is alower-powered base station, as compared with a macro cell, that mayoperate in the same or different (e.g., licensed, unlicensed, etc.)frequency bands as macro cells. Small cells may include pico cells,femto cells, and micro cells according to various examples. A pico cellmay cover a relatively smaller geographic area and may allowunrestricted access by UEs with service subscriptions with the networkprovider. A femto cell also may cover a relatively small geographic area(e.g., a home) and may provide restricted access by UEs having anassociation with the femto cell (e.g., UEs in a closed subscriber group(CSG), UEs for users in the home, and the like). An eNB for a macro cellmay be referred to as a macro eNB. An eNB for a small cell may bereferred to as a small cell eNB, a pico eNB, a femto eNB or a home eNB.An eNB may support one or multiple (e.g., two, three, four, and thelike) cells (e.g., component carriers).

The wireless communications system 100 may support synchronous orasynchronous operation. For synchronous operation, the base stations mayhave similar frame timing, and transmissions from different basestations may be approximately aligned in time. For asynchronousoperation, the base stations may have different frame timing, andtransmissions from different base stations may not be aligned in time.The techniques described herein may be used for either synchronous orasynchronous operations.

The communication networks that may accommodate some of the variousdisclosed examples may be packet-based networks that operate accordingto a layered protocol stack. In the user plane, communications at thebearer or Packet Data Convergence Protocol (PDCP) layer may be IP-based.A Radio Link Control (RLC) layer may perform packet segmentation andreassembly to communicate over logical channels. A Medium Access Control(MAC) layer may perform priority handling and multiplexing of logicalchannels into transport channels. The MAC layer may also use Hybrid ARQ(HARM) to provide retransmission at the MAC layer to improve linkefficiency. In the control plane, the Radio Resource Control (RRC)protocol layer may provide establishment, configuration, and maintenanceof an RRC connection between a UE 115 and the base stations 105 or corenetwork 130 supporting radio bearers for the user plane data. At thephysical (PHY) layer, the transport channels may be mapped to physicalchannels.

The UEs 115 are dispersed throughout the wireless communications system100, and each UE 115 may be stationary or mobile. A UE 115 may alsoinclude or be referred to by those skilled in the art as a mobilestation, a subscriber station, a mobile unit, a subscriber unit, awireless unit, a remote unit, a mobile device, a wireless device, awireless communications device, a remote device, a mobile subscriberstation, an access terminal, a mobile terminal, a wireless terminal, aremote terminal, a handset, a user agent, a mobile client, a client, orsome other suitable terminology. A UE 115 may be a cellular phone, apersonal digital assistant (PDA), a wireless modem, a wirelesscommunication device, a handheld device, a tablet computer, a laptopcomputer, a cordless phone, a wireless local loop (WLL) station, or thelike. A UE may be able to communicate with various types of basestations and network equipment including macro eNBs, small cell eNBs,relay base stations, and the like.

The communication links 125 shown in wireless communications system 100may include uplink (UL) transmissions from a UE 115 to a base station105, and/or downlink (DL) transmissions, from a base station 105 to a UE115. The downlink transmissions may also be called forward linktransmissions while the uplink transmissions may also be called reverselink transmissions. Each communication link 125 may include one or morecarriers, where each carrier may be a signal made up of multiplesub-carriers (e.g., waveform signals of different frequencies) modulatedaccording to the various radio technologies described above. Eachmodulated signal may be sent on a different sub-carrier and may carrycontrol information (e.g., reference signals, control channels, etc.),overhead information, user data, etc. The communication links 125 maytransmit bidirectional communications using FDD (e.g., using pairedspectrum resources) or TDD operation (e.g., using unpaired spectrumresources). Frame structures for FDD (e.g., frame structure type 1) andTDD (e.g., frame structure type 2) may be defined.

In some embodiments of the system 100, base stations 105 and/or UEs 115may include multiple antennas for employing antenna diversity schemes toimprove communication quality and reliability between base stations 105and UEs 115. Additionally or alternatively, base stations 105 and/or UEs115 may employ multiple-input, multiple-output (MIMO) techniques thatmay take advantage of multi-path environments to transmit multiplespatial layers carrying the same or different coded data.

Wireless communications system 100 may support operation on multiplecells or carriers, a feature which may be referred to as carrieraggregation (CA) or multi-carrier operation. A carrier may also bereferred to as a component carrier (CC), a layer, a channel, etc. Theterms “carrier,” “component carrier,” “cell,” and “channel” may be usedinterchangeably herein. A UE 115 may be configured with multipledownlink CCs and one or more uplink CCs for carrier aggregation. Carrieraggregation may be used with both FDD and TDD component carriers.

LTE systems may utilize orthogonal frequency division multiple access(OFDMA) on the DL and single carrier frequency division multiple access(SC-FDMA) on the UL. OFDMA and SC-FDMA partition the system bandwidthinto multiple (K) orthogonal subcarriers, which are also commonlyreferred to as tones or bins. Each subcarrier may be modulated withdata. The spacing between adjacent subcarriers may be fixed, and thetotal number of subcarriers (K) may be dependent on the systembandwidth. For example, K may be equal to 72, 180, 300, 600, 900, or1200 with a subcarrier spacing of 15 kilohertz (KHz) for a correspondingsystem bandwidth (with guardband) of 1.4, 3, 5, 10, 15, or 20 megahertz(MHz), respectively. The system bandwidth may also be partitioned intosub-bands. For example, a sub-band may cover 1.08 MHz, and there may be1, 2, 4, 8 or 16 sub-bands.

Wireless communication system 100 may operate in an ultra high frequency(UHF) frequency region using frequency bands from 700 MHz to 2600 MHz(2.6 GHz), although in some cases WLAN networks may use frequencies ashigh as 4 GHz. This region may also be known as the decimeter band,since the wavelengths range from approximately one decimeter to onemeter in length. UHF waves may propagate mainly by line of sight, andmay be blocked by buildings and environmental features. However, thewaves may penetrate walls sufficiently to provide service to UEs 115located indoors. Transmission of UHF waves is characterized by smallerantennas and shorter range (e.g., less than 100 km) compared totransmission using the smaller frequencies (and longer waves) of thehigh frequency (HF) or very high frequency (VHF) portion of thespectrum. In some cases, wireless communication system 100 may alsoutilize extremely high frequency (EHF) portions of the spectrum (e.g.,from 30 GHz to 300 GHz). This region may also be known as the millimeterwave band (or mmW), since the wavelengths range from approximately onemillimeter to one centimeter in length. Thus, EHF antennas may be evensmaller and more closely spaced than UHF antennas. In some cases, thismay facilitate use of antenna arrays within a UE 115 (e.g., fordirectional beamforming). However, EHF transmissions may be subject toeven greater atmospheric attenuation and shorter range than UHFtransmissions.

One or more of the UEs 115 may be configured to communicate in more thanone EHF frequency ranges, e.g., on different mmW frequency bands. Incertain aspects, the UE 115 may be configured according to the presentlydescribed transceiver architecture and may include first and secondtransceiver chip modules. Each transceiver chip module may be adapted tocommunicate (e.g., transmit and/or receive) on a different mmW frequencyrange. A first of the transceiver chip modules may include a basebandsub-module that may be associated with one or more baseband signals. Thefirst transceiver chip module may also include a first RFFE componentand associated first antenna array. The first RFFE component andassociated antenna array may be configured to communicate in the firstfrequency range. The second transceiver chip module may include a secondRFFE and associated second antenna array. The second RFFE component andassociated antenna may be configured to communicate in the secondfrequency range.

The second transceiver chip module may be separate from the firsttransceiver chip module, but electrically coupled to the basebandsub-module of the first transceiver chip module. For example, a signalcoaxial cable may be used to electrically couple the second transceiverchip module to the baseband sub-module of the first transceiver chipmodule. The coaxial cable may be a high bandwidth cable and carry IFsignal(s), local-oscillator (LO) signal(s), as well as controlsignaling. The second transceiver chip module being separate from, butelectrically coupled to, the first transceiver chip module may permitutilizing the baseband sub-module functions for the second RFFE andassociated antenna array. Also, the second transceiver chip module beingseparate may provide certain flexibility as to where the second antennaarray can be positioned on the UE 115, e.g., to avoid or reduceinterference.

One or more of the UEs 115 may be configured to communicate in more thanone EHF frequency ranges, e.g., on different mmW frequency bands. Incertain aspects, the UE 115 may be configured according to the describedtransceiver architecture and may include a first module having basebandcircuitry and a second module having a dual-transceiver RFFE componentand associated antenna arrays. For example, the baseband chip module mayinclude first and second baseband circuitry, the first basebandcircuitry for communicating in the first frequency range and the secondbaseband circuitry for communicating in the second frequency range. Thedual-transceiver chip module may include the RFFE component coupled withfirst and second antenna arrays (associated with communicating in thefirst and second frequency ranges, respectively). The baseband chipmodule and the dual-transceiver chip module may be connected using asingle coaxial cable, which may provide for flexible placement of thedual-transceiver chip module (and by extension the first and secondantenna arrays) on the UE 115. The coaxial cable may carry an IF signaland, in some cases, the LO signal and control information associatedwith communicating in the first and second frequency ranges.

In some aspects, multiplexers may be utilized at the baseband chipmodule and the dual-transceiver chip module to multiplex one or more IFsignal(s), LO signal(s), control information, and the like. Accordingly,the coaxial cable may be adapted to carry high bandwidth signals.Further, each transceiver function of the dual-RFFE component mayutilize a SIF transceiver architecture and/or a super-heterodynetransceiver architecture.

Multipath propagation may also impact the use of directionalbeamforming. It may be caused by different copies of a wireless signalreaching a receiver via different paths with varying path lengths. Thedifferent path lengths may be based on, for example, atmosphericreflection and refraction, or reflection from buildings, water, andother surfaces. Multipath propagation may result in a time delay (or aphase shift) for one copy of a signal, which cause constructive ordestructive interference (between consecutive symbols, inter-symbolinterference (ISI), or within a single symbol). A guard interval (GI)(which may include a cyclic prefix) may be prepended to transmissions tomitigate the effects of channel spreading caused by multipathpropagation.

In some cases, a BS 105 may use a plurality of antenna arrays whencommunicating with a UE 115. By using the plurality of antenna arrays,the BS 105 may increase coverage, increase link budget, or increase thenumber of systems with which the system may operate. Further, the UE 115may use a plurality of antenna arrays when communicating with the BS105. By using the plurality of antenna arrays, the UE 115 may enhancecoverage, save transmit/receive power (e.g., due to a decreased numberof antennae in each array), or increase the number of systems with whichthe system may operate.

A device, such as a BS 105 or a UE 115, may use a number of antennaarrays. Each antenna array may be swept, such as through beam formedsweeping, over a smaller spatial coverage area, as an increase in thenumber of antenna arrays may allow each antenna array to cover lessarea. Additionally, a preferred antenna may be stored, such as arecently used antenna if the two devices have previously communicated.The beam formed sweeping may initially use the preferred antenna, if oneis present, which may reduce the time necessary to find a suitableantenna array.

In some cases, a device, such as a BS 105 or a UE 115, may operate usingan enhanced mmW antenna arrangement, such as a 60 GHz system. The devicemay be enabled to operate using a number of systems, such as 28 GHzsystems, 40 GHz systems, and/or 60 GHz systems. A determination may bemade, such as by a BS 105, a UE 115, or another network component,whether the communication link between the devices requires an enhancedmmW antenna arrangement. If the communication link requires an enhancedmmW antenna arrangement, then the enhanced mmW antenna arrangement maybe initiated and used for communication. Further, if the communicationlink does not require an enhanced mmW antenna arrangement, the devicemay use systems other than the enhanced mmW antenna arrangement forcommunication.

FIG. 2A shows a block diagram 200-a of a device 205-a for use inwireless communication, in accordance with various aspects of thepresent disclosure. The device 205-a may be an example of one or moreaspects of a UE 115 described with reference to FIG. 1. The device 205-amay include a communications manager 210-a, a first transceiver chipmodule 215, and/or a second transceiver chip module 220. The device205-a may also be or include a processor (not shown). Each of thesemodules may be in communication with each other.

The components of the device 205-a may, individually or collectively, beimplemented using one or more application-specific integrated circuits(ASICs) adapted to perform some or all of the applicable functions inhardware. Alternatively, the functions may be performed by one or moreother processing units (or cores), on one or more integrated circuits.In other examples, other types of integrated circuits may be used (e.g.,Structured/Platform ASICs, Field Programmable Gate Arrays (FPGAs), andother Semi-Custom ICs), which may be programmed in any manner known inthe art. The functions of each module may also be implemented, in wholeor in part, with instructions embodied in a memory, formatted to beexecuted by one or more general or application-specific processors.

The communications manager 210-a may monitor, control, or otherwisemanage various aspects for communications of the device 205-a. Forexample, the communications manager 210-a may receive one or moresignals from other components, systems, protocols, etc., of the device205-a for transmission via the first transceiver chip module 215 and/orthe second transceiver chip module 220. The communications manager 210-amay, for reception functions, receive signals containing informationfrom the first transceiver chip module 215 or the second transceiverchip module 220 and communicate such information to the othercomponents, systems, etc., of the device 205-a. In addition to contentto be communicated, the communications manager may also receive,determine, or process various control signals associated withcommunications using the first transceiver chip module 215 or the secondtransceiver chip module 220. For example, control signals may includetransmit power control signals, modulation-coding scheme signals, etc.

In some aspects, the communications manager 210-a may have more than oneinterface connections to the first transceiver chip module 215, e.g., aninterface to each of two modems of the first transceiver chip module215. Accordingly, the communications manager 210-a may determine whichinterface connection to route information signals for transmission viathe first transceiver chip module 215 or the second transceiver chipmodule 220. Accordingly, the communications manager 210-a may routeinformation signals for transmission via the first frequency range orthe second frequency range. In some examples, the communications manager210-a may route information signals to both interface connections fortransmission on both of the first and second frequency ranges.

The first transceiver chip module 215 may monitor, control, or otherwisemanage aspects of communicating in a first frequency range. The firsttransceiver chip module 215 may include one or more sub-modules (e.g.,baseband circuitry, transceiver circuitry, etc.) that receive theinformation (e.g., a baseband signal) from the communications manager210-a, encode the information, and up-convert the information to atleast one frequency within the first frequency range for transmission.The first transceiver chip module 215 may include an antenna array fortransmitting the information in the first frequency range. In someexamples, the first transceiver chip module 215 is a ZIF transceiverchip configuration where the baseband signal is converted directly tothe communication frequency without being converted to an IF signal.

The second transceiver chip module 220 may monitor, control, orotherwise manage aspects of communicating in a second frequency range.The second frequency range may be different from the first frequencyrange. The second transceiver chip module 220 may be positionedseparately from the first transceiver chip module 215, but beelectrically coupled to the baseband circuitry of the first transceiverchip module 215 via a coaxial cable. In some aspects, the secondtransceiver chip module 220 may be a SIF transceiver architecture andthe coaxial cable may carry an IF signal between the baseband circuitryof the first transceiver chip module 215 and the second transceiver chipmodule 220.

The second transceiver chip module 220 may include transceiver circuitrythat receives the IF signal from the baseband circuitry of the firsttransceiver chip module 215 and converts it to at least one frequencywithin the second frequency range. The second transceiver chip module220 may include an associated antenna array and transmit the frequencywithin the second frequency range using the antenna array.

FIG. 2B shows a block diagram 200-b of a device 205-b for use inwireless communication, in accordance with various aspects of thepresent disclosure. The device 205-b may be an example of one or moreaspects of a UE 115 described with reference to FIG. 1. The device 205-bmay include a communications manager 210-b, a baseband chip module 225,and/or a dual-transceiver chip module 230. The device 205-b may also beor include a processor (not shown). Each of these modules may be incommunication with each other.

The components of the device 205-b may, individually or collectively, beimplemented using one or more application-specific integrated circuits(ASICs) adapted to perform some or all of the applicable functions inhardware. Alternatively, the functions may be performed by one or moreother processing units (or cores), on one or more integrated circuits.In other examples, other types of integrated circuits may be used (e.g.,Structured/Platform ASICs, Field Programmable Gate Arrays (FPGAs), andother Semi-Custom ICs), which may be programmed in any manner known inthe art. The functions of each module may also be implemented, in wholeor in part, with instructions embodied in a memory, formatted to beexecuted by one or more general or application-specific processors.

The communications manager 210-b may monitor, control, or otherwisemanage various aspects for communications of the device 205-b. Forexample, the communications manager 210-b may receive one or moresignals from other components, systems, protocols, etc., of the device205-b for transmission via the first frequency range and/or the secondfrequency range. The communications manager 210-b may, for receptionfunctions, receive signals containing information from the baseband chipmodule 225 and communicate such information to the other components,systems, etc., of the device 205-b. In addition to content to becommunicated, the communications manager 210-b may also receive,determine, or process various control signals associated withcommunications using the baseband chip module 225 or thedual-transceiver chip module 230. For example, control signals mayinclude transmit power control signals, modulation-coding schemesignals, etc.

In some aspects, the communications manager 210-b may have more than oneinterface connection to the baseband chip module 225, e.g., an interfaceto each of two modems of the baseband chip module 225. Accordingly, thecommunications manager 210-b may determine which interface connection toroute information signals for transmission via the first frequency rangeor the second frequency range. In some examples, the communicationsmanager 210-b may route information signals to both interfaceconnections for transmission on both of the first and second frequencyranges.

The baseband chip module 225 may monitor, control, or otherwise manageaspects of processing wireless communications in the first and/or secondfrequency ranges. The baseband chip module 225 may include one or moresub-modules (e.g., baseband circuitry, interface circuitry, etc.) thatreceives the information (e.g., a baseband signal) from thecommunications manager 210-b, encodes the information, and up-convertsthe information to at least one IF. For example, the baseband chipmodule 225 may include first baseband circuitry for processing ofwireless communications in the first frequency range and second basebandcircuitry for processing of wireless communications in the secondfrequency range. Example baseband circuitry may include, but is notlimited to, interface circuitry, mixer(s), amplifier(s), filter(s), andthe like. Accordingly, the baseband chip module 225 may output one ormore IF signals carrying the information signals for wirelesstransmission.

The dual-transceiver chip module 230 may monitor, control, or otherwisemanage aspects of communicating in the first and the second frequencyranges. The second frequency range may be different from the firstfrequency range and, in some examples, the first frequency range may belower than the second frequency range. The dual-transceiver chip module230 may be positioned separately from the baseband chip module 225, butbe electrically coupled to baseband chip module 225 via a coaxial cable.In some aspects, the dual-transceiver chip module 230 may be utilize aSIF transceiver architecture and/or a super-heterodyne transceiverarchitecture and the coaxial cable may carry one or more IF signal(s)between the baseband chip module 225 and the dual-transceiver chipmodule 230.

The dual-transceiver chip module 230 may include transceiver circuitrythat receives the IF signal(s) from the baseband chip module 225 andconverts it to at least one frequency within the first and/or the secondfrequency ranges for wireless transmission. The dual-transceiver chipmodule 230 may include a dual-band RFFE component that provides twotransceiver functionality, each transceiver functionality associatedwith one of the communications in the first frequency range or thesecond frequency range. The dual-transceiver chip module 230 may alsoinclude two antenna arrays, where a first antenna array is forcommunicating in the first frequency range and the second antenna arrayis for communicating in the second frequency range. The dual-band RFFEcomponent may be coupled for the first and second antenna arrays. Thatis, the dual-band RFFE component may be soldered or otherwise integratedonto the same module/PCB as the first and second antenna arrays areprinted on FIG. 3A shows a block diagram 300-a of a device 205-c for usein wireless communication, in accordance with various examples. Thedevice 205-c may be an example of one or more aspects of a UE 115described with reference to FIG. 1. The device 205-c may also be anexample of a device 205 described with reference to FIG. 2A or 2B. Thedevice 205-c may include a communications manager 210-c, a firsttransceiver chip module 215-a, and/or a second transceiver chip module220-a, which may be examples of the corresponding modules of device205-a. The device 205-c may also include a processor (not shown). Eachof these components may be in communication with each other. The firsttransceiver chip module 215-a may include a baseband sub-module 305and/or a first RFFE and antenna array 310. The second transceiver chipmodule 220-a may include a second RFFE and antenna array 315. Thecommunications manager 210-c may perform the functions of thecommunications manager 210 described with reference to FIG. 2A or 2B.

The baseband sub-module 305 may monitor, control, or otherwise manageaspects of a baseband signal for the device 205-c. The basebandsub-module 305 may be associated with a baseband signal and, in someexamples, more than one baseband signal. The baseband sub-module 305 mayreceive one or more information (or baseband) signals from thecommunications manager 210-c for transmission in the first frequencyrange, the second frequency range, or both frequency ranges. In someexamples, the baseband sub-module 305 may also receive control dataindicating which frequency range the information is to be transmittedin, at which transmit power level, and the like. The baseband sub-module305 may include oscillator/mixer/modem circuitry and upconvert theinformation at the baseband signal to a frequency within the firstfrequency range for transmission via the first RFFE and antenna array310. In some aspects, the baseband sub-module 305 may output a signal tothe first RFFE and antenna array 310 at an operating frequency of thefirst RFFE and antenna array 310 for wireless transmission.

When being transmitted via the second transceiver chip module 220-a, thebaseband sub-module 305 may upconvert the information to an IF signalthat is electrically coupled to the second transceiver chip module 220-avia signal path 320 for wireless transmission. Signal path 320 may be acoaxial cable and adapted to carry wideband signals, e.g., an IF signalfor the second transceiver chip module 220-a. In some examples, thesignal path 320 may also carry a LO signal as well as control data forwireless transmissions in the second frequency range.

The first RFFE and antenna array 310 may receive the signal from thebaseband sub-module 305 and prepare the signal for wireless transmissionvia the first antenna array. For example, the first RFFE and antennaarray 310 may include amplification circuitry, filtering circuitry,etc., for ensuring the signal is transmitted at the correct frequency,or frequencies for MIMO/CA transmissions, and at the proper transmitpower. In some aspects, the first RFFE and antenna array 310 may receivecontrol data from the baseband sub-module 305 including informationindicative of the transmit frequency, power, etc. The antenna array mayinclude a plurality of antenna elements adapted to communicate in thefirst frequency range, e.g., to transmit and/or receive one or moresignals within the first frequency range.

The second RFFE and antenna array 315 may receive the signal from thebaseband sub-module 305 via the signal path 320 and prepare the signalfor wireless transmission via the second antenna array. For example, thesecond RFFE and antenna array 315 may include amplification circuitry,filtering circuitry, etc., for ensuring the information is transmittedat the correct frequency, or frequencies for MIMO/CA transmissions, andat the proper transmit power. In some aspects, the second RFFE andantenna array 315 may receive control data from the baseband sub-module305 including information indicative of the transmit frequency, power,etc. The antenna array may include a plurality of antenna elementsadapted to communicate in the second frequency range, e.g., to transmitand/or receive one or more signals within the second frequency range.

FIG. 3B shows a block diagram 300-b of a device 205-d for use inwireless communication, in accordance with various examples. The device205-d may be an example of one or more aspects of a UE 115 describedwith reference to FIG. 1. The device 205-d may also be an example of adevice 205 described with reference to FIG. 2A, 2B, or 3A. The device205-d may include a communications manager 210-d, a baseband chip module225-a, and/or a dual-transceiver chip module 230-a, which may beexamples of the corresponding modules of device 205. The device 205-dmay also include a processor (not shown). Each of these components maybe in communication with each other. The baseband chip module 225-a mayinclude a first baseband circuitry 325 and/or a second basebandcircuitry 330. The dual-transceiver chip module 230-a may include adual-band RFFE 335, a first antenna array 340, and/or a second antennaarray 345. The communications manager 210-d may perform the functions ofthe communications manager 210 described with reference to FIG. 2A, 2B,or 3A.

The first baseband circuitry 325 may monitor, control, or otherwisemanage aspects of processing of wireless communications in the firstfrequency range for the device 205-d. The first baseband circuitry 325may be associated with a first baseband signal. The first basebandcircuitry 325 may receive one or more information (or baseband) signalsfrom the communications manager 210-d for transmission in the firstfrequency range. In some examples, the first baseband circuitry 325 mayalso receive control data indicating which frequency within the firstfrequency range the information is to be transmitted at, at whichtransmit power level, and the like. The first baseband circuitry 325 mayinclude various hardware/software/logic functionality, e.g., one or moreoscillator(s), mixer(s), modem circuitry, and the like, and up-convertthe information contained in the baseband signal to an IF signalassociated with the first frequency range for wireless transmission. Insome aspects, the first baseband circuitry 325 may output the IF signalto the dual-transceiver chip module 230-a to convey the baseband signal.

Similarly, the second baseband circuitry 330 may monitor, control, orotherwise manage aspects of processing of wireless communications in thesecond frequency range for the device 205-d. The second basebandcircuitry 330 may be associated with a second baseband signal. In someaspects, the first baseband signal and the second baseband signal may bethe same or may be different baseband signals. The second basebandcircuitry 330 may receive one or more information (or baseband) signalsfrom the communications manager 210-d for transmission in the secondfrequency range. In some examples, the second baseband circuitry 330 mayalso receive control data indicating which frequency within the secondfrequency range the information is to be transmitted at, at whichtransmit power level, and the like. The second baseband circuitry 330may include various hardware/software/logic functionality, e.g., one ormore oscillator(s), mixer(s), modem circuitry, and the like, andup-convert the information contained in the second baseband signal to anIF signal associated with the second frequency range for wirelesstransmission. In some aspects, the second baseband circuitry 330 mayoutput the IF signal to the dual-transceiver chip module 230-a to conveythe baseband signal.

In some aspects, the second baseband circuitry 330 may supportsuper-heterodyne transceiver operations for communicating in the secondfrequency range. For example, the second baseband circuitry 330 mayinclude or access two oscillator circuits to up-convert the basebandsignal to a first IF signal and then up-convert the IF signal to asecond IF signal, the second IF signal being at a higher IF frequencythan the first IF signal.

In some aspects, each of the first baseband circuitry 325 and the secondbaseband circuitry 330 may be manufactures separately and connected tothe baseband chip module 225-a, e.g., soldered. Alternatively, both ofthe first baseband circuitry 325 and the second baseband circuitry 330may be formed on a single die.

The dual-transceiver chip module 230-a may be separate from the basebandchip module 225-a. The dual-transceiver chip module 230-a may beelectrically coupled to the baseband chip module 225-a using a singlecoaxial cable, e.g., a wideband cable adapted to carry one or more IFsignal(s), LO signal(s), control data, etc.

The dual-band RFFE 335 may monitor, control, or otherwise manage aspectsof communicating in the first frequency range and the second frequencyrange for the device 205-d. Generally, the dual-band RFFE 335 mayinclude two transceiver circuits adapted to simultaneously communicatein the first and second frequency ranges. In some aspects, the firsttransceiver circuit, the second transceiver circuit, or both transceivercircuits may utilize a SIF transceiver architecture and/or asuper-heterodyne transceiver architecture. The first transceiver circuitmay be adapted to process signals in the first frequency range and thesecond transceiver circuit may be adapted to process signals in thesecond frequency range.

In some aspects, each of the first and second transceiver circuits ofthe dual-band RFFE 335 may be manufactures separately and connected tothe dual-transceiver chip module 230-a, e.g., soldered. Alternatively,both of the first and second transceiver chips may be formed on a singledie. One of the first or second transceiver circuitry may be a cellulartelecommunications transceiver and the other transceiver circuitry maybe a Wi-Fi communication transceiver. In some examples, both of thetransceiver circuits may be a cellular telecommunications transceiver ora Wi-Fi communication transceiver.

The first antenna array 340 may be adapted to wirelessly communicate atone or more frequencies within the first frequency range. The firstantenna array 340 may include one or more antenna elements and supportMIMO communications, carrier aggregation communication techniques,beamforming communication techniques, and the like, for communicating inthe first frequency range.

Similarly, the second antenna array 345 may be adapted to wirelesslycommunicate at one or more frequencies within the second frequencyrange. The second antenna array 345 may include one or more antennaelements and support MIMO communications, carrier aggregationcommunication techniques, beamforming communication techniques, and thelike, for communicating in the second frequency range.

In some aspects, the first antenna array 340 and the second antennaarray 345 may be printed, soldered, etc., on or within the samemodule/PCB that the dual-band RFFE 315 is printed, soldered, etc., on.Each of the first antenna array 340 and the second antenna array 345 maybe mmW antenna arrays. FIG. 4A shows a block diagram 400-a of a firsttransceiver chip module 215-b and a second transceiver chip module 220-bfor use in wireless communication, in accordance with various examples.The first transceiver chip module 215-b and/or the second transceiverchip module 220-b may be an example of one or more aspects of a UE 115described with reference to FIG. 1. The first transceiver chip module215-b and/or the second transceiver chip module 220-b may also be anexample of a device 205 described with reference to FIGS. 2A, 2B, 3A,and 3B. The first transceiver chip module 215-b may include a basebandsub-module 305-a, a first RFFE 405 and/or a first antenna array 410. Thesecond transceiver chip module 220-b may include a frequency converter415, a second RFFE 420, and/or a second antenna array 425. The basebandsub-module 305-a may be an example of and perform the functions of thebaseband sub-module 305 described with reference to FIG. 3A.

The baseband sub-module 305-a may be associated with a baseband signal.The baseband signal may be a signal carrying information, e.g., data,control information, etc., for wireless communications. The basebandsub-module 305-a may output a signal within the first frequency range,for example. In some aspects, the signal output from the basebandsub-module 305-a may be used as an IF signal and provided to the secondtransceiver chip module 220-b for conversion to an operating frequencywithin the second frequency range.

In some aspects, the baseband sub-module 305-a may include two modems. Afirst of the two modems may be configured to communicate in the firstfrequency range while the second of the two modems may be configured tocommunicate in the second frequency range. For example, the first modemmay be coupled to the first RFFE 405 were the second modem is coupled tothe second RFFE 420. In certain aspects of the two-modem configurationfor the baseband sub-module 305-a, a switching component may beincluded. The switching component may switch an information signalbetween the first modem and the second modem. Accordingly, the switchingcomponent may switch the information signal for transmission via thefirst frequency range or the second frequency range, respectively.

In some aspects, the baseband sub-module 305-a may include one modem.The single modem may be a dual-band modem that is adapted to communicatein the first frequency range and/or the second frequency range. Forexample, the single modem may have two outputs—a first output for thefirst RFFE 405 and a second output for the second RFFE 420.Alternatively, the dual-band modem may include one output and aswitching component coupling the output information signal to thedesired RFFE.

The first RFFE 405 may monitor, control, or otherwise manage aspects ofRF circuitry for the wireless transmissions in the first frequencyrange. Generally, the first RFFE 405 may include circuitry associatedwith processing the RF signal for transmission/reception in the firstfrequency range. For example, the first RFFE 405 may include impedancematching circuitry, filtering circuitry, amplification circuitry, etc.,for providing the RF signal to the first antenna array 410 at the properamplitude, at the proper frequency, and without unwanted signals. Thefirst RFFE 405 may be a ZIF transceiver architecture where the signalreceived from the baseband sub-module 305-a is already at the operatingfrequency for transmissions in the first frequency range. Accordingly,the first RFFE 405 may not have a mixer circuit to up-convert the signalreceived from the baseband sub-module 305-a.

In some aspects, the first RFFE 405 may be positioned on the same moduleor printed circuit board (PCB) as the baseband sub-module 305-a and thefirst antenna array 410. Accordingly, signal loss between saidcomponents may be minimized, at least to the extent possible. The firstantenna array 410 may, accordingly, be directly connected to the firstRFFE 405 and exchange RF signals for wireless communications. The firstantenna array 410 may include a plurality of antenna elements and beadapted to communicate using various wireless transmission schemes,e.g., MIMO transmissions, beam-forming transmissions, multi-carriertransmissions, etc.

The frequency converter 415 may manage aspects of signal up-convertingand/or down-converting for the second transceiver chip module 220-b. Forexample, the frequency converter 415 may be electrically coupled to thebaseband sub-module 305-a and exchange an IF signal. While the IF signalmay, in some examples, be the operating frequency for the first RFFE405, the frequency converter 415 may convert the IF signal to a higherfrequency for transmission in the second frequency range, i.e.,up-convert. That is, the frequency converter 415 may up-convert thesignal received from the baseband sub-module 305-a and output a signalwithin the second frequency range for wireless transmission. Forreception, the frequency converter 415 may down-convert the signalwithin the second frequency range and output a signal having a frequencyfor the baseband signal.

The frequency converter 415 may be electrically coupled to the basebandsub-module 305-a via signal path 320-a. Generally, signal path 320-a maybe a single coaxial cable and may be adapted to carry wideband signals.In some examples, the IF signal as well as a LO signal and/or controlinformation may be carried by the signal path 320-a. Moreover, thecoaxial cable forming the signal path 320-a may permit the secondtransceiver chip module 220-b to be positioned separate from the firsttransceiver chip module 215-b. This may provide for strategicallypositioning the first transceiver chip module 215-b (and associatedfirst antenna array 410) and the second transceiver chip module 220-b(and associated second antenna array 425) at locations on a UE to ensureoptimal communications.

The second RFFE 420 may monitor, control, or otherwise manage aspects ofRF circuitry for the wireless transmissions in the second frequencyrange for the second transceiver chip module 220-b. Generally, thesecond RFFE 420 may include circuitry associated with processing the RFsignal for transmission/reception in the second frequency range. Forexample, the second RFFE 420 may include impedance matching circuitry,filtering circuitry, amplification circuitry, etc., for providing the RFsignal to the second antenna array 425 at the proper amplitude, at theproper frequency, and without unwanted signals. The second RFFE 420 maybe a SIF transceiver architecture where the IF signal received from thebaseband sub-module 305-a is applied to the frequency converter 415 tobe up-converted to the operating frequency for transmissions in thesecond frequency range.

In some aspects, the second RFFE 420 and associated second antenna array425 may be positioned on a different module or PCB from the firsttransceiver chip module 215-b. The second antenna array 425 may bedirectly connected to the second RFFE 420 and exchange RF signals forwireless communications. The second antenna array 425 may include aplurality of antenna elements and be adapted to communicate usingvarious wireless transmission schemes, e.g., MIMO transmissions,beam-forming transmissions, multi-carrier transmissions, etc.

In some aspects, the first frequency range may be lower than the secondfrequency range. For example, the first frequency range may beassociated with a wireless telecommunication system and the secondfrequency range may be associated with a Wi-Fi communication system. Thefirst frequency range and the second frequency range may be mmWfrequency ranges. For example, the first frequency range may beassociated with a communications protocol operating at or about the 28GHz frequency range, at or about the 40 GHz frequency range, and thelike. The second frequency range may be associated with a communicationsprotocol operating at or about the 40 GHz frequency range, at or aboutthe 60 GHz frequency range, or the like, respectively.

FIG. 4B shows a block diagram 400-b of a baseband chip module 225-b anda dual-transceiver chip module 230-b for use in wireless communication,in accordance with various examples. The baseband chip module 225-band/or the dual-transceiver chip module 230-b may be an example of oneor more aspects of a UE 115 described with reference to FIG. 1. Thebaseband chip module 225-b and/or the dual-transceiver chip module 230-bmay also be an example of a device 205 described with reference to FIG.2B or 3B. The baseband chip module 225-b may include a first basebandcircuitry 325-a and/or a second baseband circuitry 330-a. Thedual-transceiver chip module 230-b may include a dual-band RFFE 335-a, afirst antenna array 340-a, and/or a second antenna array 345-a. Thebaseband chip module 225-b may be an example of and perform thefunctions of the baseband chip module 225 described with reference toFIGS. 2B and 3B. The dual-transceiver chip module 230-b may be anexample of and perform the functions of the dual-transceiver chip module230 described with reference to FIGS. 2B and 3B. The baseband chipmodule 225-b may be separate from and electrically coupled to thedual-transceiver chip module 230-b via signal path 430.

The baseband chip module 225-b may be associated with a baseband signaland, in some examples, more than one baseband signal. The one or morebaseband signals may be a signal carrying information, e.g., data,control information, etc., for wireless communications in a firstfrequency range, a second frequency range, or both frequency ranges.Other control information may provide instructions pertaining to thewireless communications, e.g., power, frequency, and the like.

The first baseband circuitry 325-a may provide for baseband processingof wireless communications in the first frequency range. The secondbaseband circuitry 330-a may provide for baseband processing of wirelesscommunications in the second frequency range. The first basebandcircuitry 325-a may include a first modem associated with communicatingin the first frequency range and the second baseband circuitry 330-a mayinclude a second modem associated with communicating in the secondfrequency range. In some aspects, the baseband chip module 225-b mayinclude interface circuitry. For example, the baseband chip module 225-bmay include a first communication interface circuitry associated withthe first modem and a second communication interface associated with thesecond modem. The first communication interface circuitry may beassociated with and provide input/output functionality for the firstbaseband circuitry 325-a and the second communication interfacecircuitry may be associated with and provide input/output functionalityfor the second baseband circuitry 330-a. In another example, thebaseband chip module 225-b may include a common interface circuitry. Thecommon interface circuitry may be associated with communicatinginformation via the first modem and the second modem. The commoninterface circuitry may include a switching function that determineswhich information is provided to the first mode, to the second modem, orto both the first and second modems.

The first baseband circuitry 325-a may output a first IF signalassociated with communicating in the first frequency range. The secondbaseband circuitry 330-a may output a second IF signal associated withcommunicating in the second frequency range. In some examples, thesecond IF signal may be at a higher frequency than the first IF signal.The first and second IF signals may be output to the dual-transceiverchip module 230-b.

The dual-band RFFE 335-a may monitor, control, or otherwise manageaspects of communicating in the first frequency range and the secondfrequency range. Generally, the dual-band RFFE 335-a may include twotransceiver circuits adapted to simultaneously communicate in the firstand second frequency ranges. In some aspects, the first transceivercircuit, the second transceiver circuit, or both transceiver circuitsmay utilize a SIF transceiver architecture and/or a super-heterodynetransceiver architecture. The first transceiver circuit may be adaptedto process signals in the first frequency range and the secondtransceiver circuit may be adapted to process signals in the secondfrequency range.

In some aspects, each of the first and second transceiver circuits ofthe dual-band RFFE 335-a may be manufactures separately and connected tothe dual-transceiver chip module 230-b, e.g., soldered. Alternatively,both of the first and second transceiver chips may be formed on a singledie. One of the first or second transceiver circuitry may be a cellulartelecommunications transceiver and the other transceiver circuitry maybe a Wi-Fi communication transceiver. In some examples, both of thetransceiver circuits may be a cellular telecommunications transceiver ora Wi-Fi communication transceiver.

The first antenna array 340-a may be adapted to wirelessly communicateat one or more frequencies within the first frequency range. The firstantenna array 340-a may include one or more antenna elements and supportMIMO communications, carrier aggregation communication techniques,beamforming communication techniques, and the like, for communicating inthe first frequency range.

Similarly, the second antenna array 345-a may be adapted to wirelesslycommunicate at one or more frequencies within the second frequencyrange. The second antenna array 345-a may include one or more antennaelements and support MIMO communications, carrier aggregationcommunication techniques, beamforming communication techniques, and thelike, for communicating in the second frequency range.

In some aspects, the first antenna array 340-a and the second antennaarray 345-a may be printed, soldered, etc., on or within the samemodule/PCB that the dual-band RFFE 315-a is printed, soldered, etc., on.Each of the first antenna array 340-a and the second antenna array 345-amay be mmW antenna arrays.

The signal path 430 may provide for electrically coupling the basebandchip module 225-b to the dual-transceiver chip module 230-b. The signalpath 430 may be a single coaxial cable. The coaxial cable may be adaptedto carry high bandwidth signals. For example, the coaxial cable maycarry one or more IF signal(s), one or more oscillator signal(s),control signaling. In one example, the coaxial cable is configured tosupport communications of high bandwidth signals, e.g., a first IFsignal associated with the first frequency range and a second IF signalassociated with the second frequency range. The first IF signal may bedifferent than the second IF signal.

In some examples, multiplexing circuitry may be used to electricallycouple the baseband chip module 225-b to the dual-transceiver chipmodule 230-b. For example, the baseband chip module may include a firstmultiplexer and the dual-transceiver chip module 230-b may include asecond multiplexer. The multiplexers may be configured to multiplex andde-multiplex signals exchanged between the baseband chip module 225-band the dual-transceiver chip module 230-b. For example, themultiplexers may multiplex/de-multiplex IF signal(s), oscillatorsignal(s), control signaling, and the like. Accordingly, the coaxialcable forming signal path 430 may support communicating signals having ahigh bandwidth.

In some aspects, the first frequency range may be lower than the secondfrequency range. For example, the first frequency range may beassociated with a wireless telecommunication system and the secondfrequency range may be associated with a Wi-Fi communication system. Thefirst frequency range and the second frequency range may be mmWfrequency ranges. For example, the first frequency range may beassociated with a communications protocol operating at or about the 28GHz frequency range, at or about the 40 GHz frequency range, and thelike. The second frequency range may be associated with a communicationsprotocol operating at or about the 40 GHz frequency range, at or aboutthe 60 GHz frequency range, or the like, respectively. FIG. 5A shows ablock diagram 500-a of a first transceiver chip module 215-c and asecond transceiver chip module 220-c for use in wireless communication,in accordance with various examples. The first transceiver chip module215-c and/or the second transceiver chip module 220-c may be an exampleof one or more aspects of a UE 115 described with reference to FIG. 1.The first transceiver chip module 215-c and/or the second transceiverchip module 220-c may also be an example of a device 205 described withreference to FIGS. 2A, 2B, 3A, and 3B. The first transceiver chip module215-c may include a baseband sub-module that includes a first interfacecircuitry 505, a second interface circuitry 510, an oscillator circuitry515, a first mixer 520, a second mixer 525, and a switch 530. The firsttransceiver chip module 215-c may also include a first RFFE and antennaarray that includes a plurality of RF circuitry components 535 andantenna elements 540 and 545. The second transceiver chip module 220-cmay include a second RFFE and antenna array that includes a frequencyconverter 555, a plurality of RF circuitry components 560 and associatedantenna elements 565 and 570.

The first and second interface circuitry 505 and 510, respectively, mayinclude components associated with receiving and sending data, controlinformation, etc., associated with wireless transmission. For example,each interface circuitry may include a modem, filters, amplifiers, etc.,adapted to process and control such data, control information, and thelike. Oscillator circuitry 515 may include one, or more than oneoscillators for generating a signal at a predetermined frequency. Forinstance, the oscillator circuitry 515 may output a local oscillatorsignal, a signal in the IF frequency range, and the like. The oscillatorcircuitry 515 may output one of more of said signals to the first mixer520 and/or the second mixer 525. In some aspects, the first mixer 520may mix the output signal of the oscillator circuitry 515 with thesignal received from the first interface circuitry 505 to output asignal having a frequency in the first frequency range. The first mixer520 may output the mixed signal at the first frequency range to theswitch 530.

Similarly, second mixer 525 may mix the output signal of the oscillatorcircuitry 515 with the signal received from the second interfacecircuitry 510 and output a signal having a frequency in the firstfrequency range. The second mixer 525 may output the mixed signal at thefirst frequency range to the switch 530. The switch 530 may route theoutputs of the first mixer 520, the second mixer 525, or the outputs ofboth mixers, to the desired RFFE and antenna array. For example, theswitch 530 may route the output of the first mixer 520 to the first RFFEand antenna array. As the first RFFE and antenna array are positioned onthe same module or PCB as the baseband sub-module, the switch may bedirectly connected to the first RFFE. For example, the switch 530 mayroute the output signal to one or more of the plurality of RF components535 (only one being labeled for ease of reference). The RF components535 may process the received signal and output a signal in the firstfrequency range to one or more of the antenna elements 540, 545 of thefirst antenna array. Only antenna elements 540 and 545 are labeled foreach of reference. From the antenna elements 540, 545, the signal iswirelessly transmitted to a receiving device. It can be appreciated thatfor receive operations, the foregoing functions may be performed inreverse for the received signal.

Additionally or alternatively, the switch 530 may route the outputs ofthe first mixer 520, the second mixer 525, or the outputs of bothmixers, to the frequency converter 55 of the second transceiver chipmodule 220-c via the signal path 550. The signal path 550 may be acoaxial cable that permits the second transceiver chip module 220-c tobe separate from the first transceiver chip module 215-c, but beelectrically coupled. The switch 530 may also route control information,a LO signal, etc., from the baseband sub-module to the secondtransceiver chip module 220-c. The frequency converter 555 may upconvertthe IF signal received from the switch 530 to a signal within the secondfrequency range. The frequency converter 555 may route the up-convertedsignal to one or more of the plurality of RF components 560 (only onebeing labeled for ease of reference). The RF components 560 may processthe received signal and output a signal in the second frequency range toone or more of the antenna elements 565, 570 of the second antennaarray. Only antenna elements 565 and 570 are labeled for each ofreference. From the antenna elements 565, 570, the signal is wirelesslytransmitted to a receiving device. It can be appreciated that forreceive operations, the foregoing functions may be performed in reversefor the received signal.

FIG. 5B shows a block diagram 500-b of a baseband chip module 225-c anda dual-transceiver chip module 230-c for use in wireless communication,in accordance with various examples. The baseband chip module 225-cand/or the dual-transceiver chip module 230-c may be an example of oneor more aspects of a UE 115 described with reference to FIG. 1. Thebaseband chip module 225-c and/or the dual-transceiver chip module 230-cmay also be an example of a device 205 described with reference to FIGS.2A, 2B, 3A, and 3B. The baseband chip module 225-c may include a firstbaseband circuitry 325-b, a second baseband circuitry 330-b, anoscillator 575 and a multiplexer 580. The dual-transceiver chip module230-c may include a multiplexer 585, a dual-band RFFE 335-b, a firstantenna array 340-b and a second antenna array 345-b.

The baseband chip module 225-c may be associated with a baseband signaland, in some examples, more than one baseband signal. The one or morebaseband signals may be a signal carrying information, e.g., data,control information, etc., for wireless communications in a firstfrequency range, a second frequency range, or both frequency ranges.Other control information may provide instructions pertaining to thewireless communications, e.g., power, frequency, and the like.

The first baseband circuitry 325-b may provide for baseband processingof wireless communications in the first frequency range. The secondbaseband circuitry 330-b may provide for baseband processing of wirelesscommunications in the second frequency range. The oscillator 575 mayprovide a signal, or more than one signal, associated with communicatingin the first frequency range, the second frequency range, or both thefirst and second frequency ranges. For example, the oscillator mayinclude one or more oscillator circuits, e.g., voltage-controlledoscillators, that may output a first IF signal associated withcommunicating in the first frequency range, a second IF signalassociated with communicating in the second frequency range, or both. Insome examples, the second IF signal may be at a higher frequency thanthe first IF signal. The first and second IF signals may be output tothe first baseband circuitry 325-b and the second baseband circuitry330-b, respectively.

The dual-band RFFE 335-b may monitor, control, or otherwise manageaspects of communicating in the first frequency range and the secondfrequency range. Generally, the dual-band RFFE 335-b may include twotransceiver circuits adapted to simultaneously communicate in the firstand second frequency ranges. In some aspects, the first transceivercircuit, the second transceiver circuit, or both transceiver circuitsmay utilize a SIF transceiver architecture and/or a super-heterodynetransceiver architecture. The first transceiver circuit may be adaptedto process signals in the first frequency range and the secondtransceiver circuit may be adapted to process signals in the secondfrequency range.

In some aspects, each of the first and second transceiver circuits ofthe dual-band RFFE 335-b may be manufactures separately and connected tothe dual-transceiver chip module 230-c, e.g., soldered. Alternatively,both of the first and second transceiver chips may be formed on a singledie. One of the first or second transceiver circuitry may be a cellulartelecommunications transceiver and the other transceiver circuitry maybe a Wi-Fi communication transceiver. In some examples, both of thetransceiver circuits may be a cellular telecommunications transceiver ora Wi-Fi communication transceiver.

The first antenna array 340-b may include a plurality of antennaelements and be adapted to wirelessly communicate at one or morefrequencies within the first frequency range. The first antenna array340-b may support MIMO communications, carrier aggregation communicationtechniques, beamforming communication techniques, and the like, forcommunicating in the first frequency range.

Similarly, the second antenna array 345-b may include a plurality ofantenna elements and be adapted to wirelessly communicate at one or morefrequencies within the second frequency range. The second antenna array345-b may also support MIMO communications, carrier aggregationcommunication techniques, beamforming communication techniques, and thelike, for communicating in the second frequency range.

In some aspects, the first antenna array 340-b and the second antennaarray 345-b may be printed, soldered, etc., on or within the samemodule/PCB that the dual-band RFFE 335-b is printed, soldered, etc., on.

The signal path 430-a may provide for electrically coupling the basebandchip module 225-c to the dual-transceiver chip module 230-c. The signalpath 430-a may be a single coaxial cable. The coaxial cable may beadapted to carry high bandwidth signals. For example, the coaxial cablemay carry one or more IF signal(s), one or more oscillator signal(s),control signaling, etc. In one example, the coaxial cable is configuredto support communications of high bandwidth signals, e.g., a first IFsignal associated with the first frequency range and a second IF signalassociated with the second frequency range. The first IF signal may bedifferent than the second IF signal.

In some examples, multiplexer 580 and multiplexer 585 may be used toelectrically couple the baseband chip module 225-c to thedual-transceiver chip module 230-c. For example, the multiplexer 580 ofthe baseband chip module 225-c and the multiplexer 585 of thedual-transceiver chip module 230-c may be adapted to multiplex, mix,etc., the various IF, LO, control signaling, etc., for communicationalong the coaxial cable. The multiplexers 580 and 585 may be configuredto multiplex and de-multiplex signals exchanged between the basebandchip module 225-c and the dual-transceiver chip module 230-c. Forexample, the multiplexers 580 and 585 may multiplex/de-multiplex IFsignal(s), oscillator signal(s), control signaling, and the like.Accordingly, the coaxial cable forming signal path 430-a may supportcommunicating signals having a high bandwidth. FIG. 6 shows a system 600for use in wireless communication, in accordance with various examples.System 600 may include a UE 115-a, which may be an example of the UEs115 of FIG. 1. UE 115-a may also be an example of one or more aspects ofdevices 205 of FIGS. 2A, 2B, 3A, and 3B. The UE 115-a may alsoincorporate aspects of the first transceiver chip module 215 and/or thesecond transceiver chip module 220 described with reference to FIGS. 2A,3A, 4A, and 5A.

The UE 115-a may generally include components for bi-directional voiceand data communications including components for transmittingcommunications and components for receiving communications. The UE 115-amay include a first transceiver chip module 625 and associatedantenna(s) 630, a second transceiver chip module 635 and associatedantenna(s) 640, a processor module 605, a memory 615 (including software(SW) 520), and a communications manager 210-e, which each maycommunicate, directly or indirectly, with each other (e.g., via one ormore buses 645). The first transceiver chip module 625 and associatedantenna(s) 630 may be configured to communicate bi-directionally in afirst frequency range, with one or more networks, as described above.For example, the first transceiver chip module 625 may be configured tocommunicate bi-directionally with base stations 105 with reference toFIG. 1. The transceiver module 625 may include a baseband sub-moduleconfigured to modulate the packets and provide the modulated packets tothe antenna(s) 630 for transmission, and to demodulate packets receivedfrom the antenna(s) 630.

The second transceiver chip module 635 may be separate from the firsttransceiver chip module 625 and be electrically coupled to a basebandsub-module. The second transceiver chip module 635 and associatedantenna(s) 640 may be configured to communicate bi-directionally in asecond frequency range, with one or more networks, as described above.For example, the second transceiver chip module 635 may be configured tocommunicate bi-directionally with base stations 105 with reference toFIG. 1. The second transceiver chip module 635 may exchange an IFsignal, a LO signal, and/or control data with the baseband sub-module ofthe first transceiver chip module 625. The baseband sub-module may alsoinclude a modem for modulating and de-modulating information signals tobe transmitted in the second frequency range via the second transceiverchip module 635. Generally, the antenna(s) 630 and the antenna(s) 640are antenna arrays, each configured to communicate in the first andsecond frequency ranges, respectively. The UE 115-a may be capable ofconcurrently transmitting and/or receiving multiple wirelesstransmissions in the first and/or the second frequency ranges.

The UE 115-a may include a communications manager 210-e, which mayperform the functions described above for the communications manager 210of device 205 of FIGS. 2A, 2B, 3A, and 3B.

The memory 615 may include random access memory (RAM) and read-onlymemory (ROM). The memory 615 may store computer-readable,computer-executable software/firmware code 620 containing instructionsthat are configured to, when executed, cause the processor module 605 toperform various functions described herein (e.g., communications infirst and second frequency ranges via the first transceiver chip module625 and the second transceiver chip module 635, respectively, etc.).Alternatively, the computer-readable, computer-executablesoftware/firmware code 620 may not be directly executable by theprocessor module 605 but be configured to cause a computer (e.g., whencompiled and executed) to perform functions described herein. Theprocessor module 605 may include an intelligent hardware device, e.g., acentral processing unit (CPU), a microcontroller, anapplication-specific integrated circuit (ASIC), etc.

FIG. 7 shows a system 700 for use in wireless communication, inaccordance with various examples. System 700 may include a UE 115-b,which may be an example of the UEs 115 of FIG. 1 or 6. UE 115-a may alsobe an example of one or more aspects of devices 205 of FIGS. 2A, 2B, 3A,and 3B. The UE 115-b may also incorporate aspects of the baseband chipmodule 225 and/or the dual-transceiver chip module 230 described withreference to FIGS. 2B, 3B, 4B, and 5B.

The UE 115-b may generally include components for bi-directional voiceand data communications including components for transmittingcommunications and components for receiving communications. The UE 115-bmay include a baseband chip module 725, a dual-transceiver chip module730, and associated first antenna array 735 and second antenna array740, a processor module 705, a memory 715 (including software (SW) 720),and a communications manager 210-f, which each may communicate, directlyor indirectly, with each other (e.g., via one or more buses 745). Thebaseband chip module 725, the dual-transceiver chip module 730, andassociated antenna arrays 735 and 740 may be configured to communicatebi-directionally in a first frequency range and a second frequencyrange, with one or more networks, as described above. The baseband chipmodule 725 may include one or more modems configured to modulate thepackets and provide the modulated packets to the dual-transceiver chipmodule 730 for up-conversion and sending on to antenna arrays 735 and/or740 for transmission, and to demodulate packets received from theantenna arrays 735 and 740.

The dual-transceiver chip module 730 may be separate from the basebandchip module 725 and be electrically coupled to the baseband chip module725. The dual-transceiver chip module 730 may exchange an IF signal, aLO signal, and/or control data with the baseband chip module 725. The UE115-b may be capable of concurrently transmitting and/or receivingmultiple wireless transmissions in the first and/or the second frequencyranges.

The UE 115-b may include a communications manager 210-f, which mayperform the functions described above for the communications manager 210of device 205 of FIGS. 2A, 2B, 3A, and 3B.

The memory 715 may include random access memory (RAM) and read-onlymemory (ROM). The memory 715 may store computer-readable,computer-executable software/firmware code 720 containing instructionsthat are configured to, when executed, cause the processor module 705 toperform various functions described herein (e.g., communications infirst and second frequency ranges via the baseband chip module 725 andthe dual-transceiver chip module 730, etc.). Alternatively, thecomputer-readable, computer-executable software/firmware code 720 maynot be directly executable by the processor module 705 but be configuredto cause a computer (e.g., when compiled and executed) to performfunctions described herein. The processor module 705 may include anintelligent hardware device, e.g., a central processing unit (CPU), amicrocontroller, an application-specific integrated circuit (ASIC), etc.

FIG. 8 shows a block diagram of a wireless device 800 configured formultiple array mmW transceiver operation in accordance with variousaspects of the present disclosure. Wireless device 800 may be an exampleof aspects of a base station 105 described with reference to FIGS. 1,and 13-16. Wireless device 800 may include a receiver 805, a mmWtransceiver controller 810, or a transmitter 815. Wireless device 800may also include a processor. Each of these components may be incommunication with each other.

The receiver 805 may receive information such as packets, user data, orcontrol information associated with various information channels (e.g.,control channels, data channels, and information related to multiplearray mmW transceiver operation, etc.). Information may be passed on tothe mmW transceiver controller 810, and to other components of wirelessdevice 800.

The mmW transceiver controller 810 may perform a beam sweep operation onbeams created by one or more arrays of a plurality of antenna arrays,and select an array from the plurality of antenna arrays forcommunication with a target wireless device based at least in part onthe beam sweep operation.

The transmitter 815 may transmit signals received from other componentsof wireless device 800. In some examples, the transmitter 815 may becollocated with the receiver 805 in a transceiver module. Thetransmitter 815 may include a single antenna, or it may include aplurality of antennas. In some examples, the transmitter 815 maycommunicate with a target wireless device using a selected array of thebase station 105 and a selected transceiver of the UE 115.

FIG. 9 shows a block diagram of a wireless device 900 for multiple arraymmW transceiver operation in accordance with various aspects of thepresent disclosure. Wireless device 900 may be an example of aspects ofa wireless device 205 or a base station 105 described with reference toFIGS. 1-5B, and 13-16. Wireless device 900 may include a receiver 805-a,a mmW transceiver controller 810-a, or a transmitter 815-a. Wirelessdevice 900 may also include a processor. Each of these components may bein communication with each other. The mmW transceiver controller 810-amay also include a beam sweeper 905, and an array selector 910.

The receiver 805-a may receive information which may be passed on to mmWtransceiver controller 810-a, and to other components of a base station105. The mmW transceiver controller 810-a may perform the operationsdescribed herein with reference to FIG. 8. The transmitter 815-a maytransmit signals received from other components of wireless device 900.

The beam sweeper 905 may perform a beam sweep operation on beams createdby one or more arrays of a plurality of antenna arrays as describedherein with reference to FIGS. 13-16. For example, the beam sweeper 905may select an initial array from the plurality of antenna arrays for thebeam sweep operation, wherein performing the beam sweep operationcomprises sweeping through each of a first plurality of beams associatedwith the initial array. The beam sweeper 905 may also select asubsequent array from the plurality of antenna arrays for the beam sweepoperation, wherein performing the beam sweep operation comprisessweeping through each of a second plurality of beams associated with thesubsequent array. In some examples, a first array of the plurality ofantenna arrays may be located at an opposite side of the mmW basestation relative to a second array of the plurality of antenna arraysbased at least in part on a spatial diversity configuration. In someexamples, at least one array of the plurality of antenna arrays may beconfigured for operation in a mmW frequency range. In some examples, theat least one array may be configured for operation in a first mmWfrequency range that operates at or about 28 GHz or in a second mmWfrequency range that operates at or about 40 GHz. In some examples, theat least one array may be paired with at least one adjacent arrayconfigured for operation in a third mmW frequency range that operates ator about 60 GHz. In some examples, each of the plurality of antennaarrays may be configured with an increased number of antenna elements.

The array selector 910 may select an array from the plurality of antennaarrays for communication with a target wireless device based at least inpart on the beam sweep operation as described herein with reference toFIGS. 13-16. The array selector 910 may also determine that a channelparameter associated with the array satisfies a threshold conditionbased at least in part on the beam sweep operation, wherein selectingthe array is based at least in part on the determination.

FIG. 10 shows a block diagram 1000 of a mmW transceiver controller 810-bwhich may be a component of a wireless device 800 or a wireless device900 for multiple array mmW transceiver operation in accordance withvarious aspects of the present disclosure. The mmW transceivercontroller 810-b may be an example of aspects of a mmW transceivercontroller 810 described with reference to FIGS. 8-9. The mmWtransceiver controller 810-b may include a beam sweeper 905-a, and anarray selector 910-a. Each of these modules may perform the functionsdescribed herein with reference to FIG. 9. The mmW transceivercontroller 810-b may also include a throughput monitor 1005, atransceiver availability module 1010, a transceiver handoff module 1015,and a transceiver activation module 1020.

The throughput monitor 1005 may determine that a target throughput isgreater than a threshold as described herein with reference to FIGS.13-16. In some examples, the threshold may be 1 Gbps.

The transceiver availability module 1010 may determine that atransceiver for the target wireless device is available, the transceiveroperating in a first mmW frequency range as described herein withreference to FIGS. 13-16. In some examples, the first mmW frequencyrange may be a 60 GHz range.

The transceiver handoff module 1015 may transmit a handoff signal to thetarget wireless device based at least in part on the determination thatthe target throughput is greater than the threshold, the determinationthat the transceiver is available, and the beam sweep operation, whereinthe handoff signal directs the target wireless device to use thetransceiver for communication as described herein with reference toFIGS. 13-16.

The transceiver activation module 1020 may transmit an activation signalto the target wireless device directing the target wireless device toactivate the transceiver as described herein with reference to FIGS.13-16. In some examples, the activation signal may be transmitted usinga second mmW frequency range, the second mmW frequency range beingdifferent from the first mmW frequency range.

FIG. 11 illustrates a block diagram of a system 1100 including a basestation that supports multiple array mmW transceiver operation inaccordance with various aspects of the present disclosure. System 1100may include a base station 105-a which may be an example of a wirelessdevice 800, a wireless device 900, or a base station 105 as describedherein with reference to FIGS. 1, 8, 9, 10, and 13-16. Base station105-a may include a mmW transceiver controller 1110 as described hereinwith reference to FIGS. 14-16. Base station 105-a may communicatewirelessly with one or more UEs 115 such as UE 115-c or UE 115-d usingone or more mmW antenna arrays.

In some cases, base station 105-a may have one or more wired backhaullinks. Base station 105-a may have a wired backhaul link (e.g., Siinterface, etc.) to the core network 130. Base station 105-a may alsocommunicate with other base stations 105, such as base station 105-b andbase station 105-c via inter-base station backhaul links (e.g., an X2interface). Each of the base stations 105 may communicate with UEs 115using the same or different wireless communications technologies. Insome cases, base station 105-a may communicate with other base stationssuch as 105-b or 105-c utilizing base station communication module 1125.In some examples, base station communication module 1125 may provide anX2 interface within an LTE/LTE-A wireless communication networktechnology to provide communication between some of the base stations105. In some examples, base station 105-a may communicate with otherbase stations through core network 130. In some cases, base station105-a may communicate with the core network 130 through networkcommunications module 1130.

The base station 105-a may include a processor 1105, memory 1115(including software (SW) 1120), transceiver 1135, and antenna(s) 1140,which each may be in communication, directly or indirectly, with oneanother (e.g., over bus system 1145). The transceivers 1135 may beconfigured to communicate bi-directionally, via the antenna(s) 1140,with the UEs 115, which may be multi-mode devices. The transceiver 1135(or other components of the base station 105-a) may also be configuredto communicate bi-directionally, via the antennas 1140, with one or moreother base stations (not shown). The transceiver 1135 may include amodem configured to modulate the packets and provide the modulatedpackets to the antennas 1140 for transmission, and to demodulate packetsreceived from the antennas 1140. The base station 105-a may includemultiple transceivers 1135, each with one or more associated antennas1140. The transceiver may be an example of a combined receiver 805 andtransmitter 815 of FIG. 8.

The memory 1115 may include RAM and ROM. The memory 1115 may also storecomputer-readable, computer-executable software code 1120 containinginstructions that are configured to, when executed, cause the processor1105 to perform various functions described herein (e.g., multiple arraymmW transceiver operation), selecting coverage enhancement techniques,call processing, database management, message routing, etc.).Alternatively, the software 1120 may not be directly executable by theprocessor 1105 but be configured to cause the computer, e.g., whencompiled and executed, to perform functions described herein. Theprocessor 1105 may include an intelligent hardware device, e.g., a CPU,a microcontroller, an ASIC, etc. The processor 1105 may include variousspecial purpose processors such as encoders, queue processing modules,base band processors, radio head controllers, DSPs, and the like.

The base station communications module 1125 may manage communicationswith other base stations 105. The communications management module mayinclude a controller or scheduler for controlling communications withUEs 115 in cooperation with other base stations 105. For example, thebase station communications module 1125 may coordinate scheduling fortransmissions to UEs 115 for various interference mitigation techniquessuch as beamforming or joint transmission.

The components of the wireless device 800, wireless device 900, mmWtransceiver controller 810 or system 1100 may, individually orcollectively, be implemented with at least one ASIC adapted to performsome or all of the applicable functions in hardware. Alternatively, thefunctions may be performed by one or more other processing units (orcores), on at least one IC. In other examples, other types of integratedcircuits may be used (e.g., Structured/Platform ASICs, an FPGA, oranother semi-custom IC), which may be programmed in any manner known inthe art. The functions of each unit may also be implemented, in whole orin part, with instructions embodied in a memory, formatted to beexecuted by one or more general or application-specific processors.

FIG. 12 shows a diagram 1200 of example configurations for two antennaarrays on the dual-transceiver chip module for use in wirelesscommunication, in accordance with various examples. The exampleconfigurations for the first and second antenna arrays may illustrateaspects of the UEs 115 of FIG. 1, the devices 205 described withreference to FIGS. 2B and 3B, and/or the dual-transceiver chip modules230 described with reference to FIGS. 4B and 5B. Generally, the diagram1200 illustrates various configurations for implementing the firstantenna array 340 and the second antenna array 345 of thedual-transceiver chip module.

As discussed above, the first antenna array 340 and the second antennaarray 345 are positioned on the same module/PCB as the dual-band RFFEcomponent 335. In some examples, the first antenna array 340 and thesecond antenna array 345 may be printed on the same die used to form thedual-transceiver chip module 230. The various configurations shown indiagram 1200 show just some examples of placement for the two antennaarrays.

For example and referring first to configuration A), thedual-transceiver chip module 230-d may include the first antenna array340-c and the second antenna array 345-c. In configuration A), the firstand second antenna arrays are positioned on a same side (shown as thetop side) of the dual-transceiver chip module 230-d. Moreover, the firstand second antenna arrays are positioned on opposing ends of the top ofthe dual-transceiver chip module 230-d.

As another example and referring to configuration B), thedual-transceiver chip module 230-e may include the first antenna array340-d and the second antenna array 345-d. In configuration B), the firstand second antenna arrays are positioned on opposing sides (shown as thetop and bottom) of the dual-transceiver chip module 230-e. Althoughconfiguration B) shows the first and second antenna arrays arepositioned on opposing ends of the dual-transceiver chip module 230-e,it is to be understood that the first and second antenna arrays may bealigned on the opposing sides such that the first antenna array 340-d isdirectly above (or below) the second antenna array 345-d. Other spacingconfigurations may also be utilized.

As yet another example and referring to configuration C), thedual-transceiver chip module 230-f may include the first antenna array340-e and the second antenna array 345-e. In configuration C), thedual-transceiver chip module 230-f may be formed of multiple layers,e.g., layers 1205, 1210, and 1215 (although more or fewer layer may alsobe used. In configuration C), the first and second antenna arrays arepositioned on different layers (shown as layers 1205 and 1210) of thedual-transceiver chip module 230-f. Although configuration C) shows thefirst and second antenna arrays are positioned on layers 1205 and 1210of the dual-transceiver chip module 230-f, it is to be understood thatthe first and second antenna arrays may be positioned on other layers,in one layer and on a surface, and the like, as well as being alignedsuch that the first antenna array 340-e is directly above (or below) thesecond antenna array 345-e. Other spacing configurations may also beutilized.

Accordingly, it can be appreciated that various placement options may beavailable for positioning the first and second antenna arrays of thedual-transceiver chip module. This may provide for flexibility inpositioning the dual-transceiver chip module on or within the device(e.g., UE 115) to avoid interference caused by surrounding componentsand/or user interference. FIG. 13 illustrates an example of a wirelesscommunications subsystem 1300 for multiple array mmW transceiveroperation in accordance with various aspects of the present disclosure.Wireless communications subsystem 1300 may include a base station (BS)105-d, which may be an example of a base station 105 described hereinwith reference to FIG. 1. Wireless communications subsystem 1300 mayalso include a UE 115-e, which may be an example of a UE 115 describedherein with reference to FIG. 1.

The BS 105-d may include a BS transceiver 1305. In some cases, the BStransceiver 1305 may include a number of antenna arrays 1315, such asfour, which may be arranged on different sides of the device for spatialdiversity. The antenna arrays 1315 may be used to transmit/receivesignals which may be modulated/demodulated using a modem 1320. In somecases, a single modem 1320 may be used for a number of antenna arrays1315. Alternatively, a number of modems 1320 may be included in the BStransceiver 1305, such as to operate a number of antenna arrays 1315.The antenna arrays 1315 may be operable at a number of bands, such as 28GHz, 40 GHz, and/or 60 GHz bands. In some cases, different arrays withinthe antenna array 1315 may operate, or be operable, using differentfrequency bands or the same frequency bands. The antenna arrays 1315 mayeach include a radio frequency front end bus (RFFE), such as forcommunication with the modem 1320 or other BS 105-d components, and/or anumber of antennas, such as configured in an array. The modem 1320 maybe operable at a number of bands, such as 28 GHz, 40 GHz, and/or 60 GHzbands. In some cases, the BS transceiver 1305 may include a number ofmodems 1320 to support multiple frequency bands. in some cases, eachantenna array for one mmW frequency band (e.g., 28 GHz or 40 GHz) may bepaired with another array designed for operation in another frequencyband (such as 60 GHz).

The BS 105-d may communicate with the UE 115-e using a communicationlink 125-a, which may be an example of the communication links 125 ofFIG. 1. In some cases, the UE 115-e may include a UE transceiver 1310.The UE transceiver 1310 may include a number of antenna arrays 1325,such as two. The antenna arrays 1325 may be used to transmit/receivesignals which may be modulated/demodulated using a modem 1330. In somecases, a single modem 1330 may be used for a number of antenna arrays1325. Alternatively, a number of modems 1330 may be included in the UEtransceiver 1310, such as to operate a number of antenna arrays 1325. Insome cases, the antenna arrays 1325 of the UE transceiver 1310 mayinclude some or all of the features of characteristics of the antennaarrays 1315 of the BS transceiver 1305. In some cases, the modem 1330 ofthe UE transceiver 1310 may include some or all of the features orcharacteristics of the modem 1320 of the BS transceiver 1305. In somecases, the link throughput between the BS 105-d and UE 115-e may dependon both the number and arrangement of antennas at both devices.

The BS 105-d may establish or reestablish a connection with the UE115-e. If the UE 115-e was previously in communication with the BS105-d, the BS 105-d may attempt to reestablish the connection bystarting with the most recently used antenna, or sector. If the UE 115-eand BS 105-d are attempting to establish a new connection, the BS 105-dmay attempt to establish connection by starting with an initial antenna,or sector. The initial antenna array may be determined in a number ofways, such as in quasi-real-time, periodically, predefined, throughsignaling, or based on past performance, priorities (e.g., one antennaprioritized over another), etc. Upon choosing an antenna array to startwith, a beam sweep may be performed, such as through all beams at theantenna array. Each link may be analyzed to determine whether linkcharacteristics are sufficient for an expected or required throughput.If the link characteristics are sufficient, the array may becharacterized as a preferred array, and may be used for communicationbetween the BS 105-d and the UE 115-e. If the link characteristics arenot sufficient, or preferred, another array may be chosen and a beamsweep through all beams of the new array may be performed, such as untilan array meets the preferred or required link characteristics. The newarray may be chosen in a number of ways, such as sequentially, in apredefined pattern, through signaling, based on past performance, etc.

In some cases, such as when a 60 GHz operating band is available, acertain band or antenna array 1315 or 1325 may be prioritized overothers. For example, an antenna array operating at 60 GHz may bepreferable to an antenna array operating at 28 GHz or 40 GHZ. As aresult, the antenna array operating at 60 GHz may be beam swept beforethe other antenna arrays, or if an antenna array is capable of operatingacross multiple bands, the antenna array may attempt to operatesatisfactorily at a preferred band, such as 60 GHz, before attempting tooperate satisfactorily at another band.

FIG. 14 illustrates an example of a beam configuration 1400 for multiplearray mmW transceiver operation in accordance with various aspects ofthe present disclosure. Beam configuration 1400 may represent theantenna array configuration of a base station 105 or a UE 115 asdescribed herein with reference to FIGS. 1 and 13.

In some cases, the antenna array 1315-a may be similar to, or the sameas, the antenna arrays 1315 and/or the antenna arrays 1325 of FIG. 13.The modem 1320-a may be similar to, or the same as, the modem 1320and/or the modem 1330 of FIG. 13. Further, the beam configuration 1400may be included in a BS, such as BS 105 in FIG. 1, a UE, such as UE 115in FIG. 1, or another network component. In some cases, antenna array1315-a may be paired or collocated with another array designed foroperation in another frequency band (e.g., it may be a 28 GHz or 40 GHzarray paired with a 60 GHz array)

Each antenna array 1315-a may include a coverage area 1405. The coveragearea 1405 may be predefined, signaled, determined, or based oncapabilities of the antenna array 1315-a, past performance, etc. In somecases, the introduction of additional antenna arrays 1315-a may reducethe coverage area 1405 of each antenna array 1315-a. For example, with asmall number of antenna arrays 1315-a, such as one or two, the coveragearea 1405 may be large, such as 180°. Further, with additional antennaarrays 1315-a the coverage area 1405 may be reduced, such as to 102.8°.

The beam configuration 1400 may be used to perform beam sweeping, suchas to detect link conditions and establish a connection with anotherwireless device. In some cases, an antenna array 1315-a performs beamsweeping. The antenna array 1315-a may create a number of beams 1410,which may be directional signals, such as signals which occupy a subsetof the coverage area 1405 of the antenna array 1315-a. The antenna array1315-a may sweep through a number of beams 1410, such as whilemonitoring link characteristics, and may determine whether a beam 1410has the desired or required link characteristics. The spatial coverageof a beam 1410 and/or number of beams 1410 may be predefined, signaled,determined periodically, determined in quasi-real-time, or determinedbased on antenna array 1315-a capabilities, past performance, etc. Anantenna array 1315-a may sweep through beams 1410 sequentially or mayprogress through beams 1410 in another way, such as non-sequentially.

FIG. 15 illustrates an example of a beam sweeping decision flow 1500 formultiple array mmW transceiver operation in accordance with variousaspects of the present disclosure. Beam sweeping decision flow 1500 maybe performed by a base station 105 or UE 115, as described herein withreference to FIGS. 1 and 13-14.

At block 1505, a wireless device may initiate a beam selectionoperation. In some examples a first array of the plurality of antennaarrays is located at an opposite side of the mmW base station relativeto a second array of the plurality of antenna arrays based at least inpart on a spatial diversity configuration. In some examples at least onearray of the plurality of antenna arrays is configured for operation ina mmW frequency range. In some examples the at least one array isconfigured for operation in a first mmW frequency range that operates ator about 28 GHz or in a second mmW frequency range that operates at orabout 40 GHz. In some examples the at least one array is paired with atleast one adjacent array configured for operation in a third mmWfrequency range that operates at or about 60 GHz. In some examples eachof the plurality of antenna arrays is configured with an increasednumber of antenna elements. The device may then perform a beam sweepoperation on beams created by one or more arrays of a set of antennaarrays.

At block 1510, a determination may be made, such as by a BS 105, a UE115, or another network component, whether there is a preferred array touse. The preferred array may be an array most recently used, or an arraywhich exhibited preferred link characteristics, if a connection haspreviously been established and is being reestablished. In some cases,it may be assumed that the receiving device, such as a UE 115, does notchange sector often and therefore the preferred array is likely toexhibit the preferred link characteristics.

At block 1515, if it is determined that there is not a preferred arrayat block 1510, a beam sweep may be performed through beams at a firstarray.

At block 1520, a variable, N, may store an identifier of the first arrayto be swept.

At block 1525, if it is determined that there is a preferred array atblock 1510, a beam sweep may be performed through beams of the preferredarray.

At block 1530, the variable, N, may store an identifier of the preferredarray.

At block 1535, a determination may be made, such as by a BS 105, a UE115, or another network component, whether link characteristics of alink determined during the beam sweep of blocks 1515 or 1525 meet atleast one criterion, such as exceeding a minimum value. For example, theminimum value may be a SNR, a channel quality information (CQI) value, abandwidth, a throughput, etc.

At block 1540, if it is determined that the link characteristics do notmeet the at least one criterion, N may be changed, such as incrementedby one, to another array, such as array N+1.

At block 1545, a beam sweep may be performed through beams of array N.The process may return to block 1535.

At block 1550, if it is determined that the link characteristics meetthe at least one criterion, the array may be remembered, such as storedin memory, as a preferred array. Subsequently, communications may occurusing the preferred array. Thus, the device may select an array from theset of antenna arrays for communication with a target wireless devicebased on the beam sweep operation.

FIG. 16 illustrates an example of a transceiver selection process flow1600 for multiple array mmW transceiver operation in accordance withvarious aspects of the present disclosure. Transceiver selection processflow 1600 may be performed by a base station 105 as described hereinwith reference to FIGS. 1 and 13-14.

At block 1605, a device may initiate a process for selecting a mmWtransceiver. For example, a base station 105 may begin a process fordetermining whether to switch communications from one mmW frequencyrange to another in order to increase the throughput of a communicationslink.

At block 1610, a determination may be made, such as by a BS 105, a UE115, or another network component, whether a required or preferred linkcharacteristic involves use of an enhanced mmW antenna arrangement(e.g., a 60 GHz system), such as whether required capacity exceeds 1Gbps. Thus, the device may determine that a target throughput is greaterthan a threshold.

At block 1615, if it is determined that a link characteristic does notinvolve use of an enhanced mmW antenna arrangement, then the process maycontinue with a traditional system. For example, if the requiredcapacity is less than 1 Gbps then a connection may be established usinga 28 GHz or 40 GHz system, similar to the process described in FIG. 14or 15. For example, a base station 105 may select an initial array fromthe set of antenna arrays for the beam sweep operation, whereinperforming the beam sweep operation includes sweeping through each of afirst set of beams associated with the initial array. The base station105 may select a subsequent array from the set of antenna arrays for thebeam sweep operation, wherein performing the beam sweep operationincludes sweeping through each of a second set of beams associated withthe subsequent array. The base station 105 may determine that a channelparameter associated with the array satisfies a threshold conditionbased on the beam sweep operation, such that selecting the array basedon the determination.

At block 1620, if it is determined that a required or preferred linkcharacteristic involves the use of an enhanced mmW antenna arrangement,then a determination may be made, such as by a BS 105, a UE 115, oranother network component, whether there is sufficient hardware tooperate using the enhanced mmW antenna arrangement. For example, a BS105 may determine whether a UE 115 has a transceiver active thatoperates at or about 60 GHz. If there is not sufficient hardware tooperate using the enhanced mmW antenna arrangement, the process mayreturn to block 1615. Thus, the device may determine that a transceiverfor the target wireless device may be available, the transceiveroperating in a first mmW frequency range.

At block 1625, if it is determined that there is sufficient hardware tooperate using the enhanced mmW antenna arrangement, the hardware may beactivated. For example, a UE 115 may be prompted to turn on, orinitiate, a second transceiver such as one based on a 60 GHz system. Insome cases, the device may transmit an activation signal to the targetwireless device directing the target wireless device to activate thetransceiver.

At block 1630, a beam forming process may be performed for the enhancedmmW antenna arrangement, such as for a 60 GHz system. In some cases, abeam forming process may be described in FIG. 14 or 15.

At block 1635, a determination may be made, such as by a BS 105, a UE115, or another network component, whether the beam forming process ofblock 1630 was successful. If it is determined that the beam formingprocess of block 1630 was not successful, the process may return toblock 1615.

At block 1640, if it is determined that the beam forming process ofblock 1630 was successful, a BS 105, a UE 115, or another networkcomponent may handoff data to the enhanced mmW antenna arrangement, suchas a 60 GHz system. As such, the enhanced mmW antenna arrangement may beused for subsequent communications. Thus, the device may transmit ahandoff signal to the target wireless device based on the determinationthat the target throughput may be greater than the threshold, thedetermination that the transceiver may be available, and the beam sweepoperation, wherein the handoff signal directs the target wireless deviceto use the transceiver for communication.

At block 1645, a BS 105 or UE 115 may be switched to the enhanced mmWantenna arrangement. As such, the two communicating devices, such as aBS 105 and a UE 115, may communicate with one another using the enhancedmmW antenna arrangement. Further, communication parameters may beadjusted, such as based on operating using the enhanced mmW antennaarrangement. For example, the media access control (MAC) layer capacitymay be increased by a BS 105, such as if a 60 GHz system is used. FIG.17 is a flow chart illustrating an example of a method 1700 for wirelesscommunication, in accordance with various aspects of the presentdisclosure. For clarity, the method 1700 is described below withreference to aspects of one or more of the UEs 115 described withreference to FIGS. 1 and 6, and/or aspects of one or more of the devices205 described with reference to FIGS. 2A-5B. In some examples, a UE mayexecute one or more sets of codes to control the functional elements ofthe UE to perform the functions described below. Additionally oralternatively, the UE may perform one or more of the functions describedbelow using special-purpose hardware.

At block 1705, the method 1700 may include communicating in a firstfrequency range via a first transceiver chip module. The firsttransceiver chip module may include a baseband sub-module associatedwith a baseband signal and a first RFFE component and associated firstantenna array. The first RFFE component and associated first antennaarray may be configured to communicate in the first frequency range. Thefirst RFFE component may be a ZIF transceiver architecture.

At block 1710, the method 1700 may include communicating in a secondfrequency range via a second transceiver chip module. The secondtransceiver chip module may include a second RFFE component andassociated second antenna array. The second transceiver chip module maybe separate from and electrically coupled with the baseband sub-moduleof the first transceiver chip module. The second RFFE component andassociated second antenna array may be configured to communicate in thesecond frequency range. The second frequency range may be different fromthe first frequency range. The second RFFE component may be a SIFtransceiver architecture.

The operation(s) at block 1705 and/or 1710 may be performed using thefirst transceiver chip module 215 and/or the second transceiver chipmodule 220 described with reference to FIGS. 2A, 3A, 4A, and 5A.

Thus, the method 1700 may provide for wireless communication. It shouldbe noted that the method 1700 is just one implementation and that theoperations of the method 1700 may be rearranged or otherwise modifiedsuch that other implementations are possible.

FIG. 18 is a flow chart illustrating an example of a method 1800 forwireless communication, in accordance with various aspects of thepresent disclosure. For clarity, the method 1800 is described below withreference to aspects of one or more of the UEs 115 described withreference to FIGS. 1 and 6, and/or aspects of one or more of the devices205 described with reference to FIGS. 2A-5B. In some examples, a UE mayexecute one or more sets of codes to control the functional elements ofthe UE to perform the functions described below. Additionally oralternatively, the UE may perform one or more of the functions describedbelow using special-purpose hardware.

At block 1805, the method 1800 may include coupling, electronicallyusing a single coaxial cable, a baseband sub-module of a firsttransceiver chip module with a second transceiver chip module. Thecoaxial cable may be adapted to carry wideband signals.

At block 1810, the method 1800 may include communicating in a firstfrequency range via the first transceiver chip module. The firsttransceiver chip module may include the baseband sub-module associatedwith a baseband signal and a first RFFE component and associated firstantenna array. The first RFFE component and associated first antennaarray may be configured to communicate in the first frequency range. Thefirst RFFE component may be a ZIF transceiver architecture.

At block 1815, the method 1800 may include communicating in a secondfrequency range via the second transceiver chip module. The secondtransceiver chip module may include a second RFFE component andassociated second antenna array. The second transceiver chip module maybe separate from and electrically coupled with the baseband sub-moduleof the first transceiver chip module using the single coaxial cable. Thesecond RFFE component and associated second antenna array may beconfigured to communicate in the second frequency range. The secondfrequency range may be different from the first frequency range. Thesecond RFFE component may be a SIF transceiver architecture.

The operation(s) at block 1805, 1810 and/or 1815 may be performed usingthe first transceiver chip module 215 and/or the second transceiver chipmodule 220 described with reference to FIGS. 2A, 3A, 4A, and 5A.

Thus, the method 1800 may provide for wireless communication. It shouldbe noted that the method 1800 is just one implementation and that theoperations of the method 1800 may be rearranged or otherwise modifiedsuch that other implementations are possible.

In some examples, aspects from two or more of the methods 1700 and 1800may be combined. It should be noted that the methods 1700 and 1800 arejust example implementations, and that the operations of the methods1700 and 1800 may be rearranged or otherwise modified such that otherimplementations are possible.

FIG. 19 is a flow chart illustrating an example of a method 1900 forwireless communication, in accordance with various aspects of thepresent disclosure. For clarity, the method 1900 is described below withreference to aspects of one or more of the UEs 115 described withreference to FIGS. 1 and 7, and/or aspects of one or more of the devices205 described with reference to FIGS. 2A-5B. In some examples, a UE mayexecute one or more sets of codes to control the functional elements ofthe UE to perform the functions described below. Additionally oralternatively, the UE may perform one or more of the functions describedbelow using special-purpose hardware.

At block 1905, the method 1900 may include communicating, using abaseband chip module and a dual-transceiver chip module, in a firstfrequency range via a first baseband circuitry of the baseband chipmodule. The dual-transceiver chip module may include a dual-band RFFEcomponent coupled to a first antenna array adapted to communicatewireless signals in the first frequency range.

At block 1910, the method 1900 may include communicating, using thebaseband chip module and the dual-transceiver chip module, in a secondfrequency range via a second baseband circuitry of the baseband chipmodule. The dual-transceiver chip module may include the dual-band RFFEcomponent coupled to a second antenna array adapted to communicatewireless signals in the second frequency range.

The operation(s) at block 1905 and/or 1910 may be performed using thebaseband chip module 225 and/or the dual-transceiver chip module 230described with reference to FIGS. 2B, 3B, 4B, and 5B.

Thus, the method 1900 may provide for wireless communication. It shouldbe noted that the method 1900 is just one implementation and that theoperations of the method 1900 may be rearranged or otherwise modifiedsuch that other implementations are possible.

FIG. 20 is a flow chart illustrating an example of a method 2000 forwireless communication, in accordance with various aspects of thepresent disclosure. For clarity, the method 2000 is described below withreference to aspects of one or more of the UEs 115 described withreference to FIGS. 1 and 7, and/or aspects of one or more of the devices205 described with reference to FIGS. 2A-5B. In some examples, a UE mayexecute one or more sets of codes to control the functional elements ofthe UE to perform the functions described below. Additionally oralternatively, the UE may perform one or more of the functions describedbelow using special-purpose hardware.

At block 2005, the method 2000 may include coupling, electrically usinga single coaxial cable, a baseband chip module with a dual-transceiverchip module. The coaxial cable may be adapted to carry high bandwidthsignals between the baseband chip module and the dual-transceiver chipmodule.

At block 2010, the method 2000 may include communicating, using thebaseband chip module and the dual-transceiver chip module, in a firstfrequency range via a first baseband circuitry of the baseband chipmodule. The dual-transceiver chip module may include a dual-band RFFEcomponent coupled to a first antenna array adapted to communicatewireless signals in the first frequency range.

At block 2015, the method 2000 may include communicating, using thebaseband chip module and the dual-transceiver chip module, in a secondfrequency range via a second baseband circuitry of the baseband chipmodule. The dual-transceiver chip module may include the dual-band RFFEcomponent coupled to a second antenna array adapted to communicatewireless signals in the second frequency range.

The operation(s) at block 2005, 2010, and/or 2015 may be performed usingthe baseband chip module 225 and/or the dual-transceiver chip module 230described with reference to FIGS. 2B, 3B, 4B, and 5B.

Thus, the method 2000 may provide for wireless communication. It shouldbe noted that the method 2000 is just one implementation and that theoperations of the method 2000 may be rearranged or otherwise modifiedsuch that other implementations are possible.

In some examples, aspects from two or more of the methods 1900 and 2000may be combined. It should be noted that the methods 1900 and 2000 arejust example implementations, and that the operations of the methods1900 and 2000 may be rearranged or otherwise modified such that otherimplementations are possible.

FIG. 21 shows a flowchart illustrating a method 2100 for multiple arraymmW transceiver operation in accordance with various aspects of thepresent disclosure. The operations of method 2100 may be implemented bya base station 105 or its components as described with reference toFIGS. 1, 11, and 13-16. For example, the operations of method 2100 maybe performed by the mmW transceiver controller 810 as described withreference to FIGS. 8-11. In some examples, a base station 105 mayexecute a set of codes to control the functional elements of the basestation 105 to perform the functions described below. Additionally oralternatively, the base station 105 may perform aspects the functionsdescribed below using special-purpose hardware.

At block 2105, the base station 105 may perform a beam sweep operationon beams created by one or more arrays of a plurality of antenna arraysas described herein with reference to FIGS. 13-16. In certain examples,the operations of block 2105 may be performed by the beam sweeper 905 asdescribed herein with reference to FIG. 9.

At block 2110, the base station 105 may select an array from theplurality of antenna arrays for communication with a target wirelessdevice based at least in part on the beam sweep operation as describedherein with reference to FIGS. 13-16. In certain examples, theoperations of block 2110 may be performed by the array selector 910 asdescribed herein with reference to FIG. 9.

FIG. 22 shows a flowchart illustrating a method 2200 for multiple arraymmW transceiver operation in accordance with various aspects of thepresent disclosure. The operations of method 2200 may be implemented bya base station 105 or its components as described with reference toFIGS. 1, 11, and 13-16. For example, the operations of method 2200 maybe performed by the mmW transceiver controller 810 as described withreference to FIGS. 8-11. In some examples, a base station 105 mayexecute a set of codes to control the functional elements of the basestation 105 to perform the functions described below. Additionally oralternatively, the base station 105 may perform aspects the functionsdescribed below using special-purpose hardware. The method 2200 may alsoincorporate aspects of method 2100 of FIG. 21.

At block 2205, the base station 105 may determine that a targetthroughput is greater than a threshold as described herein withreference to FIGS. 13-16. In certain examples, the operations of block2205 may be performed by the throughput monitor 1005 as described hereinwith reference to FIG. 10.

At block 2210, the base station 105 may determine that a transceiver forthe target wireless device is available, the transceiver operating in afirst mmW frequency range as described herein with reference to FIGS.13-16. In certain examples, the operations of block 2210 may beperformed by the transceiver availability module 1010 as describedherein with reference to FIG. 10.

At block 2215, the base station 105 may perform a beam sweep operationon beams created by one or more arrays of a plurality of antenna arraysas described herein with reference to FIGS. 13-16. In certain examples,the operations of block 2215 may be performed by the beam sweeper 905 asdescribed herein with reference to FIG. 9.

At block 2220, the base station 105 may select an array from theplurality of antenna arrays for communication with a target wirelessdevice based at least in part on the beam sweep operation as describedherein with reference to FIGS. 13-16. In certain examples, theoperations of block 2220 may be performed by the array selector 910 asdescribed herein with reference to FIG. 9.

At block 2225, the base station 105 may transmit a handoff signal to thetarget wireless device based at least in part on the determination thatthe target throughput is greater than the threshold, the determinationthat the transceiver is available, and the beam sweep operation, whereinthe handoff signal directs the target wireless device to use thetransceiver for communication as described herein with reference toFIGS. 13-16. In certain examples, the operations of block 2225 may beperformed by the transceiver handoff module 1015 as described hereinwith reference to FIG. 10.

FIG. 23 shows a flowchart illustrating a method 2300 for multiple arraymmW transceiver operation in accordance with various aspects of thepresent disclosure. The operations of method 2300 may be implemented bya base station 105 or its components as described with reference toFIGS. 1, 11, and 13-16. For example, the operations of method 2300 maybe performed by the mmW transceiver controller 810 as described withreference to FIGS. 8-11. In some examples, a base station 105 mayexecute a set of codes to control the functional elements of the basestation 105 to perform the functions described below. Additionally oralternatively, the base station 105 may perform aspects the functionsdescribed below using special-purpose hardware. The method 2300 may alsoincorporate aspects of methods 2100, and 2200 of FIGS. 21-22.

At block 2305, the base station 105 may determine that a targetthroughput is greater than a threshold as described herein withreference to FIGS. 13-16. In certain examples, the operations of block2305 may be performed by the throughput monitor 1005 as described hereinwith reference to FIG. 10.

At block 2310, the base station 105 may determine that a transceiver forthe target wireless device is available, the transceiver operating in afirst mmW frequency range as described herein with reference to FIGS.13-16. In certain examples, the operations of block 2310 may beperformed by the transceiver availability module 1010 as describedherein with reference to FIG. 10.

At block 2315, the base station 105 may transmit a handoff signal to thetarget wireless device based at least in part on the determination thatthe target throughput is greater than the threshold, the determinationthat the transceiver is available, and the beam sweep operation, whereinthe handoff signal directs the target wireless device to use thetransceiver for communication as described herein with reference toFIGS. 13-16. In certain examples, the operations of block 2315 may beperformed by the transceiver handoff module 1015 as described hereinwith reference to FIG. 10.

At block 2320, the base station 105 may transmit an activation signal tothe target wireless device directing the target wireless device toactivate the transceiver as described herein with reference to FIGS.13-16. In certain examples, the operations of block 2320 may beperformed by the transceiver activation module 1020 as described hereinwith reference to FIG. 10.

At block 2325, the base station 105 may perform a beam sweep operationon beams created by one or more arrays of a plurality of antenna arraysas described herein with reference to FIGS. 13-16. In certain examples,the operations of block 2325 may be performed by the beam sweeper 905 asdescribed herein with reference to FIG. 9.

At block 2330, the base station 105 may select an array from theplurality of antenna arrays for communication with a target wirelessdevice based at least in part on the beam sweep operation as describedherein with reference to FIGS. 13-16. In certain examples, theoperations of block 2330 may be performed by the array selector 910 asdescribed herein with reference to FIG. 9.

At block 2335, the base station 105 may communicate with the targetwireless device using the selected array and the transceiver asdescribed herein with reference to FIGS. 13-16. In certain examples, theoperations of block 2335 may be performed by the transmitter 815 asdescribed herein with reference to FIG. 8.

FIG. 24 shows a flowchart illustrating a method 2400 for multiple arraymmW transceiver operation in accordance with various aspects of thepresent disclosure. The operations of method 2400 may be implemented bya base station 105 or its components as described with reference toFIGS. 1, 11, and 13-16. For example, the operations of method 2400 maybe performed by the mmW transceiver controller 810 as described withreference to FIGS. 8-11. In some examples, a base station 105 mayexecute a set of codes to control the functional elements of the basestation 105 to perform the functions described below. Additionally oralternatively, the base station 105 may perform aspects the functionsdescribed below using special-purpose hardware. The method 2400 may alsoincorporate aspects of methods 2100, 2200, and 2300 of FIGS. 21-23.

At block 2405, the base station 105 may perform a beam sweep operationon beams created by one or more arrays of a plurality of antenna arraysas described herein with reference to FIGS. 13-16. In certain examples,the operations of block 2405 may be performed by the beam sweeper 905 asdescribed herein with reference to FIG. 9.

At block 2410, the base station 105 may select an array from theplurality of antenna arrays for communication with a target wirelessdevice based at least in part on the beam sweep operation as describedherein with reference to FIGS. 13-16. In certain examples, theoperations of block 2410 may be performed by the array selector 910 asdescribed herein with reference to FIG. 9.

At block 2415, the base station 105 may select an initial array from theplurality of antenna arrays for the beam sweep operation, whereinperforming the beam sweep operation comprises sweeping through each of afirst plurality of beams associated with the initial array as describedherein with reference to FIGS. 13-16. In certain examples, theoperations of block 2415 may be performed by the beam sweeper 905 asdescribed herein with reference to FIG. 9.

Thus, methods 2100, 2200, 2300, and 2400 may provide for multiple arraymmW transceiver operation. It should be noted that methods 2100, 2200,2300, and 2400 describe possible implementation, and that the operationsand the steps may be rearranged or otherwise modified such that otherimplementations are possible. In some examples, aspects from two or moreof the methods 2100, 2200, 2300, and 2400 may be combined.

Techniques described herein may be used for various wirelesscommunications systems such as CDMA, TDMA, FDMA, OFDMA, SC-FDMA, andother systems. The terms “system” and “network” are often usedinterchangeably. A CDMA system may implement a radio technology such asCDMA2000, Universal Terrestrial Radio Access (UTRA), etc. CDMA2000covers IS-2000, IS-95, and IS-856 standards. IS-2000 Releases 0 and Aare commonly referred to as CDMA2000 1×, 1×, etc. IS-856 (TIA-856) iscommonly referred to as CDMA2000 1×EV-DO, High Rate Packet Data (HRPD),etc. UTRA includes Wideband CDMA (WCDMA) and other variants of CDMA. ATDMA system may implement a radio technology such as Global System forMobile Communications (GSM). An OFDMA system may implement a radiotechnology such as Ultra Mobile Broadband (UMB), Evolved UTRA (E-UTRA),IEEE 802.11 (WiFi), IEEE 802.16 (WiMAX), IEEE 802.20, Flash-OFDM™, etc.UTRA and E-UTRA are part of Universal Mobile Telecommunication System(UMTS). 3GPP Long Term Evolution (LTE) and LTE-Advanced (LTE-A) are newreleases of UMTS that use E-UTRA. UTRA, E-UTRA, UMTS, LTE, LTE-A, andGSM are described in documents from an organization named “3rdGeneration Partnership Project” (3GPP). CDMA2000 and UMB are describedin documents from an organization named “3rd Generation PartnershipProject 2” (3GPP2). The techniques described herein may be used for thesystems and radio technologies mentioned above as well as other systemsand radio technologies, including cellular (e.g., LTE) communicationsover an unlicensed and/or shared bandwidth. The description above,however, describes an LTE/LTE-A system for purposes of example, and LTEterminology is used in much of the description above, although thetechniques are applicable beyond LTE/LTE-A applications.

The detailed description set forth above in connection with the appendeddrawings describes examples and does not represent the only examplesthat may be implemented or that are within the scope of the claims. Theterms “example” and “exemplary,” when used in this description, mean“serving as an example, instance, or illustration,” and not “preferred”or “advantageous over other examples.” The detailed description includesspecific details for the purpose of providing an understanding of thedescribed techniques. These techniques, however, may be practicedwithout these specific details. In some instances, well-known structuresand apparatuses are shown in block diagram form in order to avoidobscuring the concepts of the described examples.

Information and signals may be represented using any of a variety ofdifferent technologies and techniques. For example, data, instructions,commands, information, signals, bits, symbols, and chips that may bereferenced throughout the above description may be represented byvoltages, currents, electromagnetic waves, magnetic fields or particles,optical fields or particles, or any combination thereof.

The various illustrative blocks and components described in connectionwith the disclosure herein may be implemented or performed with ageneral-purpose processor, a digital signal processor (DSP), an ASIC, anFPGA or other programmable logic device, discrete gate or transistorlogic, discrete hardware components, or any combination thereof designedto perform the functions described herein. A general-purpose processormay be a microprocessor, but in the alternative, the processor may beany conventional processor, controller, microcontroller, or statemachine. A processor may also be implemented as a combination ofcomputing devices, e.g., a combination of a DSP and a microprocessor,multiple microprocessors, one or more microprocessors in conjunctionwith a DSP core, or any other such configuration.

The functions described herein may be implemented in hardware, softwareexecuted by a processor, firmware, or any combination thereof. Ifimplemented in software executed by a processor, the functions may bestored on or transmitted over as one or more instructions or code on acomputer-readable medium. Other examples and implementations are withinthe scope and spirit of the disclosure and appended claims. For example,due to the nature of software, functions described above can beimplemented using software executed by a processor, hardware, firmware,hardwiring, or combinations of any of these. Features implementingfunctions may also be physically located at various positions, includingbeing distributed such that portions of functions are implemented atdifferent physical locations. As used herein, including in the claims,the term “and/or,” when used in a list of two or more items, means thatany one of the listed items can be employed by itself, or anycombination of two or more of the listed items can be employed. Forexample, if a composition is described as containing components A, B,and/or C, the composition can contain A alone; B alone; C alone; A and Bin combination; A and C in combination; B and C in combination; or A, B,and C in combination. Also, as used herein, including in the claims,“or” as used in a list of items (for example, a list of items prefacedby a phrase such as “at least one of” or “one or more of”) indicates adisjunctive list such that, for example, a list of “at least one of A,B, or C” means A or B or C or AB or AC or BC or ABC (i.e., A and B andC).

Computer-readable media includes both computer storage media andcommunication media including any medium that facilitates transfer of acomputer program from one place to another. A storage medium may be anyavailable medium that can be accessed by a general purpose or specialpurpose computer. By way of example, and not limitation,computer-readable media can comprise RAM, ROM, EEPROM, flash memory,CD-ROM or other optical disk storage, magnetic disk storage or othermagnetic storage devices, or any other medium that can be used to carryor store desired program code means in the form of instructions or datastructures and that can be accessed by a general-purpose orspecial-purpose computer, or a general-purpose or special-purposeprocessor. Also, any connection is properly termed a computer-readablemedium. For example, if the software is transmitted from a website,server, or other remote source using a coaxial cable, fiber optic cable,twisted pair, digital subscriber line (DSL), or wireless technologiessuch as infrared, radio, and microwave, then the coaxial cable, fiberoptic cable, twisted pair, DSL, or wireless technologies such asinfrared, radio, and microwave are included in the definition of medium.Disk and disc, as used herein, include compact disc (CD), laser disc,optical disc, digital versatile disc (DVD), floppy disk and Blu-ray discwhere disks usually reproduce data magnetically, while discs reproducedata optically with lasers. Combinations of the above are also includedwithin the scope of computer-readable media.

The previous description of the disclosure is provided to enable aperson skilled in the art to make or use the disclosure. Variousmodifications to the disclosure will be readily apparent to thoseskilled in the art, and the generic principles defined herein may beapplied to other variations without departing from the scope of thedisclosure. Thus, the disclosure is not to be limited to the examplesand designs described herein but is to be accorded the broadest scopeconsistent with the principles and novel features disclosed herein.

What is claimed is:
 1. An apparatus for wireless communication,comprising: a first transceiver chip module comprising a basebandsub-module associated with a baseband signal, a first radio frequencyfront end (RFFE) component and associated first antenna array, the firstRFFE component and associated first antenna array configured tocommunicate in a first frequency range; and a second transceiver chipmodule comprising a second RFFE component and associated second antennaarray, the second transceiver chip module separate from and electricallycoupled with the baseband sub-module of the first transceiver chipmodule, the second RFFE component and associated second antenna arrayconfigured to communicate in a second frequency range different from thefirst frequency range.
 2. The apparatus of claim 1, further comprising:a single coaxial cable electrically coupling the second transceiver chipmodule with the baseband sub-module.
 3. The apparatus of claim 1,wherein the second transceiver chip module is configured to receive atleast one of the baseband signal, or a local oscillator signal, acontrol signal, or combinations thereof, from the baseband sub-module ofthe first transceiver chip module.
 4. The apparatus of claim 1, whereinthe second transceiver chip module further comprises: a frequencyconverter configured to up-convert the baseband signal received from thebaseband sub-module and output a signal within the second frequencyrange for wireless transmission, the frequency converter being furtherconfigured to down-convert a signal received from the second RFFEcomponent for wireless reception and output a signal having a frequencyof the baseband signal.
 5. The apparatus of claim 1, wherein thebaseband sub-module further comprises: a first modem configured tocommunicate in the first frequency range; and a second modem configuredto communicate in the second frequency range.
 6. The apparatus of claim1, wherein the baseband sub-module further comprises: a dual-band modemconfigured to communicate in the first frequency range and in the secondfrequency range.
 7. The apparatus of claim 1, wherein signals of thefirst frequency range are time-division multiplexed with signals of thesecond frequency range.
 8. The apparatus of claim 1, wherein the firstRFFE component is a zero-intermediate frequency (IF) RFFE and the secondRFFE component is a sliding IF RFFE.
 9. The apparatus of claim 1,wherein the baseband signal is within the first frequency range, thebaseband signal being used as an intermediate frequency (IF) for thesecond transceiver chip module and converted to the second frequencyrange.
 10. The apparatus of claim 1, wherein the first frequency rangeis lower than the second frequency range.
 11. The apparatus of claim 1,wherein the first frequency range is associated with a wirelesstelecommunication system and the second frequency range is associatedwith a Wi-Fi communication system.
 12. The apparatus of claim 1, whereinthe first frequency range and the second frequency range are millimeterwave frequency ranges.
 13. A method for wireless communication,comprising: communicating in a first frequency range via a firsttransceiver chip module, the first transceiver chip module comprising abaseband sub-module associated with a baseband signal and a first radiofrequency front end (RFFE) component and associated first antenna array,the first RFFE component and associated first antenna array configuredto communicate in the first frequency range; and communicating in asecond frequency range via a second transceiver chip module, the secondtransceiver chip module comprising a second RFFE component andassociated second antenna array, the second transceiver chip moduleseparate from and electrically coupled with the baseband sub-module ofthe first transceiver chip module, the second RFFE component andassociated second antenna array configured to communicate in the secondfrequency range different from the first frequency range.
 14. The methodof claim 13, further comprising: coupling, the baseband sub-module ofthe first transceiver chip module with the second transceiver chipmodule using a single coaxial cable.
 15. A method of wirelesscommunication at a millimeter wave (mmW) base station, comprising:performing a beam sweep operation on beams created by two or more arraysof a plurality of antenna arrays; and selecting an array from theplurality of antenna arrays for communication with a target wirelessdevice based at least in part on the beam sweep operation.
 16. Themethod of claim 15, further comprising: determining that a targetthroughput is greater than a threshold; determining that a transceiverfor the target wireless device is available, the transceiver operatingin a first mmW frequency range; and transmitting a handoff signal to thetarget wireless device based at least in part on the determination thatthe target throughput is greater than the threshold, the determinationthat the transceiver is available, and the beam sweep operation, whereinthe handoff signal directs the target wireless device to use thetransceiver for communication.
 17. The method of claim 16, furthercomprising: transmitting an activation signal to the target wirelessdevice directing the target wireless device to activate the transceiver;and communicating with the target wireless device using the selectedarray and the transceiver.
 18. The method of claim 15, furthercomprising: selecting an initial array from the plurality of antennaarrays for the beam sweep operation, wherein performing the beam sweepoperation comprises sweeping through each of a first plurality of beamsassociated with the initial array.
 19. The method of claim 15, furthercomprising: determining that a channel parameter associated with thearray satisfies a threshold condition based at least in part on the beamsweep operation, wherein selecting the array is based at least in parton the determination.
 20. The method of claim 15, wherein a first arrayof the plurality of antenna arrays is located at an opposite side of themmW base station relative to a second array of the plurality of antennaarrays based at least in part on a spatial diversity configuration. 21.The method of claim 15, wherein at least one array of the plurality ofantenna arrays is configured for operation in a mmW frequency range. 22.An apparatus for wireless communication, comprising: a baseband chipmodule comprising first baseband circuitry for baseband processing ofwireless communications in a first frequency range and second basebandcircuitry for baseband processing of wireless communications in a secondfrequency range; and a dual-transceiver chip module separate from and inelectrical communication with the baseband chip module, thedual-transceiver chip module comprising a dual-band radio frequencyfront end (RFFE) component, a first antenna array adapted for wirelesscommunications in the first frequency range, and a second antenna arrayadapted for wireless communications in the second frequency range, thedual-band RFFE component coupled with the first antenna array and thesecond antenna array, wherein at least one of the first frequency rangeand the second frequency range are millimeter wave frequency ranges. 23.The apparatus of claim 22, further comprising: a single coaxial wireelectrically coupling the dual-transceiver chip module with the basebandchip module.
 24. The apparatus of claim 22, wherein the first antennaarray is positioned on an opposing side of the dual-transceiver chipmodule with respect to the second antenna array.
 25. The apparatus ofclaim 22, wherein the first antenna array is positioned on a differentlayer of the dual-transceiver chip module with respect to the secondantenna array.
 26. The apparatus of claim 22, wherein the first basebandcircuitry comprises a first modem configured to communicate in the firstfrequency range and a second modem configured to communicate in thesecond frequency range.
 27. The apparatus of claim 22, wherein thebaseband chip module comprises a first multiplexer and thedual-transceiver chip module comprises a second multiplexer, the firstmultiplexer and the second multiplexer configured to multiplex andde-multiplex electrical signals exchanged between the baseband chipmodule and the dual-transceiver chip module.
 28. The apparatus of claim22, wherein the dual-transceiver chip module being in electricalcommunication with the baseband chip comprises communicating at leastone of an intermediate frequency (IF) signal, or an oscillator signal,or a control signal, or combinations thereof.
 29. The apparatus of claim22, wherein the dual-transceiver chip module is in electricalcommunication with the baseband chip module via a cable, the cableconfigured to support communications of high bandwidth signals, whereinthe high bandwidth signals comprise a first intermediate frequency (IF)signal associated with the first frequency range and a second IF signalassociated with the second frequency range, the first IF signal beingdifferent than the second IF signal.
 30. The apparatus of claim 22,wherein the first frequency range is lower than the second frequencyrange.